DEK to Spotlight Portfolio at SMT/Hybrid/Packaging


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FLEMINGTON, N.J. —DEK will showcase its products and processes at the SMT/Hybrid/Packaging exhibition, May 30–June 1, 2006, in Nuremberg, Germany. DEK's booth (7-205) will highlight solutions designed to improve productivity and performance in electronics manufacturing, as well as lead-free solutions to aid the transition to RoHS compliance.

Such solutions include the Europa and Horizon 01i and 03i mass-imaging platforms, as well as other process-enabling technologies. DEK will demonstrate the Europa with its Rapid Transit Conveyor (RTC) board transport option, which is said to reduce core cycle time to four seconds. The company will also display the HawkEye automatic high-speed print verification technology, which analyzes streamed 2-D board images in real time, generating pass/fail indications at the linebeat rate to isolate faulty boards.

Because the July 1, 2006, RoHS compliance deadline is just one month before the show, DEK will also direct much attention to its lead-free offerings, including ProFlow and VectorGuard technologies. VectorGuard Gold and Silver electroformed and laser-cut nickel stencil technologies accommodate changing paste properties through enhanced aperture release and paste volume repeatability. A ProFlow enclosed print head technology demonstration will show the machine's ability to extend mass-imaging process windows.

Nearly 23,895 visitors attended last year's SMT/Hybrid/Packaging exhibition. For more information on the show, please visit www.mesago.de. Topics at SMT/Hybrid/Packaging include:

Modern production Electronic systems Design and development Components PCBs Test systems Packaging and basis materials Machinery Apparatus Automobile engineering Information and communication technology Advanced packaging ASICs Automatic placement machines BGAs Board design FPGAs Hybrids Soldering MCMs Screen printing SMD/SMT

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