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New Products
December 31, 1969 |Estimated reading time: 5 minutes
Shape Memory Tooling
The VacuNest Shape Memory Tooling combines a custom tooling plate with the versatility of pins for printer, dispenser, and pick-and-place machines. An antistatic membrane covers a foam former that is surrounded by polymer granules. When placing a golden board onto the modules, users can press down, pull a vacuum, and the tool holds the memory of the board-shape profile. Chambers are profiled to the shape of the underside of the board. Upon vacuum activation, the shape will be held until the vacuum is released. This feature reportedly enables the quick creation of a custom board support. Because support forces are spread evenly over the board, VacuNest does not damage the component. The tooling feature is also said to eliminate the cost of a custom tooling plate and pin tooling. VacuNest can handle high-density boards. Novatec SA, Montauban, France, www.novatec-eap.com.
Aqueous Cleaner
AQUANOX A4520T aqueous chemistry cleaner for flush-mounted and fine-pitch components cleans under low standoffs and in tight spaces. The cleaner reportedly works at low temperatures and low concentrations. Its chemistry does not require the use of sump-side additives, and results in shiny joints. The cleaner’s chemistry allows for a long bath life and is RoHS-compliant. It also can clean several soils, including lead-free, tacky, no-clean, and RMA fluxes, as well as reflowed paste, OA paste, oils, fingerprints, light oxides, and polymerized soils. It is multi-metal-safe for use on yellow metals, aluminum, ferrous composites, and most precious metals. Kyzen Corp., Nashville, Tenn., www.kyzen.com.
Depaneling Saw
The S300 diamond-blade depaneling saw for singulating assembled PCBs features a 2.95"-diameter, 0.021"-thick cutting blade. Used to separate surface mount components near the edge of the parting section, these saws are said to leave a smooth finish with little stress to the board. The saws can also singulate PCBs without scorelines, or with overhanging components on the parting line. The working areas are enclosed in plexiglass to prevent direct access to the blade. FKN Systek, Framingham, Mass., www.fknsystek.com.
Standalone AOI System
The standalone OptiCon BasicLine 1M/4M features a modularly extendable camera that allows alternate selection between a one- or four-megapixel camera. For higher test coverage, users can add camera options for thru-hole components, color inspection, or 3-D measurement. Angled view inspection is also available for J-lead pins at PLCC and SOJ components. Based on a linear drive method, the system is said to increase test speeds by 50% compared to previous generations. A Quattro multi-colored top illumination is included, allowing a high-contrast display of colored polarity markings, thereby eliminating interference effects of solder masks and fluxes. GÖEPEL electronic, Jena, Germany, www.goepel.com.
Flexible Chipshooter
The MG-2 can be used as a standalone chipshooter with speeds up to 40,000 cph, or with the MG-1 and/or MG-8 multifunctional machines for applications that require additional chipshooting capacity. A dual-gantry system carries four beams, each with six heads. The MG-2 places components from 01005s to chip-scale packages (CSPs), BGAs, PLCCs, and QFPs with a maximum size of 14 mm2 and 50-µm accuracy at 3 sigma. The chipshooter accepts 96 smart feeders, and accommodates tape, stick, and bulk feeders. Assembléon, Eindhoven, The Netherlands, www.assembleon.com.
Lead-free Flux Remover
LFFR is a fast-drying solvent cleaner formulated to remove lead-free residues quickly. Effective on R, RA, RMA, and no-clean flux residues, the cleaner also removes residues associated with tin/lead soldering. LFFR is available as a 400-ml aerosol with a brush to work the product into stubborn contamination areas. It features a 100% ozone-friendly solvent, and leaves a clean, dry surface without greasy deposits. Electrolube, a division of H K Wentworth Limited, Derbyshire, England, www.electrolube.com.
Stencil Wiping Rolls
GREEN MONSTER ESD stencil-wiping rolls do not use weak paper or tissue fibers, which typically are held together by weak hydrogen bonds that break down when wet. GREEN MONSTER rolls use thick, coarse rayon fibers with a higher porosity to absorb solvents. The fibers allow for the use of more vacuum to further clean solder paste from apertures. High-Tech Conversions, Inc., East Windsor, Conn., www.high-techconversions.com.
Surface Mount Inductor/Transformer
The DR359 Series surface mount inductor/transformer features a dual-coil design in a low-profile package for handheld electronic devices. Series inductance ranges are 0.47-1000 mH, and operating-temperatures are -40º-125°C. The components measure 12.5 mm2, and have flat-top surfaces for high-speed automated pick-and-place equipment. Available in either tube or tape-and-reel packaging, the series is UL94V-0 compliant. Datatronic Distribution, Inc., Romoland, Calif., www.datatronics.com.
Fine-pitch Printer
Using a rigid frame/table and high-accuracy AC servos, the SI-P300 screen printer delivers 0.3-mm fine-pitch printing. A board-removal mechanism offers a vacuum and two-stage plate removal to optimize control. A built-in, 1.3-megapixel charge-coupled device (CCD) camera provides post-print inspection, while automatic cloth-and-paper methods clean stencils. The printer accommodates boards 0.4-3.0-mm thick, and 50 mm2 to 460 × 510 mm in size. Print repeatability is ±20 µm with a cycle time of 10 seconds. Sony Manufacturing Systems Corp., Lake Forest, Calif., www.sonysms.com.
Boundary-scan Test
ScanExpress Merge is said to extend boundary-scan tool capabilities to testing and programming multi-assembly systems composed of multiple boards, daughtercards, backplanes, connectors, and cables. The tool generates a unified set of input files that mesh with the ScanExpressTPG Test Program Generator, processing the merged assemblies automatically and generating test vectors for the system. The system combines board data and ScanIO and ScanDIMM parallel I/O modules into a single set of input files that are compatible with the program generator. When linking boards using a connector, ScanExpress Merge finds and connects relevant nets on both sides automatically. Corelis, Inc., Cerritos, Calif., www.corelis.com.
Lead-free Solder Paste
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with CSP lead pitches of 0.5 and 0.4 mm. The formula is said to deliver low voiding in BGA joints over a range of reflow profiles, and offers long-abandon-time capabilities. Tack force resists component shifting during high-speed placement, enables a fast print speed with low print pressure to minimize board warpage, and resists humidity. The material produces safe residues that eliminate the need for cleaning. Post-reflow, low-color residues are also said to aid visual inspection. The electronics group of Henkel, Irvine, Calif., www.electronics.henkel.com.