Nexlogic Expands to Larger Facility

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SAN JOSE, Calif. — Nexlogic Technologies has moved PCB design, assembly, fabrication, and procurement operations from a 11,000-square foot building to a 30,000-square-foot facility featuring new equipment and services, noting growth in servicing the medical, military/aerospace, semiconductor, and industrial markets.

The company can support OEMs requiring lead-free manufacturing, and has added a third SMT line, a dedicated lead-free wave solder machine, automated optical inspection (AOI), and enhanced BGA X-ray capabilities, dedicated lead-free processes, and nitrogen reflow capabilities. Nexlogic recently held an open house and facility tour.



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