-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
iNEMI Roadmap Workshop: One Week to Register
March 22, 2006 |Estimated reading time: Less than a minute
HERNDON, Va. — Registration for the International Electronics Manufacturing Initiative (iNEMI)'s 2007 Roadmap workshop, to be held together with SEMICON Europa in Munich, Germany, on April 5th, closes on March 28, 2006, barring full capacity prior to the date. The full-day meeting will give attendees a first-look at draft chapters of the 2007 Roadmap, including two key market segments and eight technology and infrastructure areas the Roadmap covers.
Technology and infrastructure areas of focus within the Roadmap include:
Product Sectors
Automotive products (Galen Reeder, Delphi) Consumer/portable products (Seppo Pienamaa, Nokia)Technology Areas
Packaging (Bill Bottoms, NanoNexus) Board assembly (Chuck Richardson, iNEMI) Organic substrates (Michael Weinhold, EIPC) Ceramic substrates (Paul Collander, Poltronics) Sensors (Tim McBride, Texas Instruments) Test, inspection, and measurement (Michael Smith, Teradyne) Final assembly (Bernd Heger, Delphi) Environmentally conscious electronics (Nils Nissen, Fraunhofer IZM)The workshop is co-sponsored by Fraunhofer IZM, IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society, and IMAPS Europe. Discussion and input are welcome from attendees for inclusion in draft chapters, to ensure inclusion of European issues in the Roadmap. For more information, or to register, please click here.