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HERNDON, Va. — Registration for the International Electronics Manufacturing Initiative (iNEMI)'s 2007 Roadmap workshop, to be held together with SEMICON Europa in Munich, Germany, on April 5th, closes on March 28, 2006, barring full capacity prior to the date. The full-day meeting will give attendees a first-look at draft chapters of the 2007 Roadmap, including two key market segments and eight technology and infrastructure areas the Roadmap covers.
Technology and infrastructure areas of focus within the Roadmap include:
Product SectorsAutomotive products (Galen Reeder, Delphi) Consumer/portable products (Seppo Pienamaa, Nokia)
Technology AreasPackaging (Bill Bottoms, NanoNexus) Board assembly (Chuck Richardson, iNEMI) Organic substrates (Michael Weinhold, EIPC) Ceramic substrates (Paul Collander, Poltronics) Sensors (Tim McBride, Texas Instruments) Test, inspection, and measurement (Michael Smith, Teradyne) Final assembly (Bernd Heger, Delphi) Environmentally conscious electronics (Nils Nissen, Fraunhofer IZM)
The workshop is co-sponsored by Fraunhofer IZM, IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society, and IMAPS Europe. Discussion and input are welcome from attendees for inclusion in draft chapters, to ensure inclusion of European issues in the Roadmap. For more information, or to register, please click here.