NEPCON China Summit Touts Lead-free


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SHANGHAI, China — NEPCON/EMT China, to take place April 4–7, 2006, in Shanghai, is an SMT-focused event that offers networking opportunities and the latest information on the newest products. Held annually, this year's show will target the lead-free transition since the looming July 1, 2006 deadline is right around the corner, giving attendees plenty of options in implementing lead-free in time.

To help cool the lead-free transition burn, NEPCON China will offer a full-day Lead-free Conference, titled "Practical Tips and Considerations for Lead-free Transition," on April 3rd. Sponsored by the SMTA, the program will offer paper sessions on RoHS/WEEE compliance management, lead-free process optimization, lead-free rework process and reliability, and RoHS compliance testing.

VJ Electronix's Al Cabral, product management and applications leader, will contribute a paper presentation to Session 4: Lead-free Rework Process and Reliability, titled "Addressing New Rework Challenges in the Lead-free Process," which will take place from 3:30–5:00 p.m. Other paper presentations assigned to Session 4 include:

"iNEMI Lead-free Micro-BGA, CBGA, Mictor Connector, and Through-Hole PDIP Rework Evaluations," to be presented by Sunny Zhang of Solectron Suzhou. "An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability Under Various Thermal Cycle Conditions," to be presented by Ning Pan of Cisco Systems.

For a complete breakdown of the Lead-free Conference's events, please visit www.nepconchina.com/s_conference.asp.

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