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Stencil Printing Workshops Available
March 14, 2006 |Estimated reading time: Less than a minute
COLORADO SPRINGS, Colo. — Photo Stencil's upcoming 2006 workshops will provide information on stencil printing performance and how stencil technology and stencil design each impact this performance. Data generated by independent test laboratories during print performance studies, along with Photo Stencil's Dr. Bill Coleman, vice president of technology, and Mike Burgess, stencil product manager, will come together to offer pertinent information.
These hands-on workshops are targeted to process and quality control engineers, supervisors, managers, and technicians who are involved with solder paste screen printing, process control, solder paste selection, and the assembly process. Topics will include print process and stencil technology; stencil design and applications; lead-free process impacts; SMT assembly and inspection tools; intrusive reflow; and solder paste volume studies for measuring the print performance of electroformed, laser, and chemical-etch stencils.
Each one-day workshop will start at 9:00 a.m. and adjourn at 4:00 p.m, and will be held at Photo Stencil's Colorado Springs headquarters. In 2006, workshops will be held on March 17th, April 21st, May 26th, June 23rd, July 21st, August 25th, September 22nd, October 27th, and November 17th. For more information, please contact Dr. Coleman at (719) 535-8528, or bcoleman@photostencil.com, or visit www.photostencil.com/workshops.htm.