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CLINTON, N.Y. — At the upcoming Intel Lead-free Symposium, to take place March 15–16, 2006, in Scottsdale, Ariz., Indium Corp. of America's Dr. Ning-Cheng Lee, vice president of technology, will highlight reliability in a presentation there. Dr. Lee's experience spans the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives.
Dr. Lee's presentation will cover the part that fluxes and pastes play on the impact and challenges for next-generation fluxes and pastes in drop-critical applications, but from a supplier's point of view. His presentation will primarily focus on: flux/paste formulation directions; expected challenges; assembly implications/challenges; and integration implications/challenges with the shift to lead-free fluxes.
For more information on the Intel Lead-free Symposium, an IPC-sponsored event, please visit www.ipc.org/calendar/2006/LF_AZ_3_06_Letter.pdf.