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iNEMI Hi-Rel Group Tackles Lead-free Manufacturing Challenges
March 7, 2006 |Estimated reading time: 1 minute
HERNDON, Va. — iNEMI's High-Reliability RoHS Task Force has issued recommendations for manufacturing complex, thermally challenging electronic assemblies using lead-free processes. These recommendations target thermal requirements for components, laminate and PWB materials, and equipment, and aim to help ensure product reliability.
Most high-reliability products have a lead solder exemption or fly under the RoHS Directive's radar, and the companies that manufacture such products are evaluating the impact of lead-free SAC solder assembly on the reliability of these applications. The complex assemblies found in high-reliability products often feature broad component mixes and present thermal challenges as a result of board thermal properties and the resulting thermal gradients across the assembly.
Lead-free assembly already poses challenges for manufacturers because of the higher temperatures required and the resulting tighter processing windows. When assembling complex assemblies, these challenges intensify by component mass variability, large size, and high layer count of PWBs; the need to rework; and the possibility of mixed thru-hole, surface mount, and back-side assembly.
"New soldering materials, maximum qualified component temperatures, and primary attach and/or rework equipment all need to be addressed relative to reliability in the face of lead-free assembly requirements," says Joe Smetana, principal engineer of advanced technology for Alcatel and co-chair of the iNEMI High-Reliability RoHS Task Force. "These recommendations were developed to communicate the needs of the high-reliability segment to the supply chain and the relevant standards groups that must address these needs."
For more information, and to view the list of recommendations, please visit www.inemi.org/cms/projects/ese/High_Rel_RoHS.html.