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SMT Magazine Honors 2005 VISION Awards Winners
December 31, 1969 |Estimated reading time: 4 minutes
ANAHEIM, Calif. — SMT Magazine announced recipients of its 2005 VISION Awards during the 14th Annual VISION Awards ceremony and celebration, held February 8, 2006, at the Marriott Hotel in Anaheim, Calif. Nearly 300 people attended the awards ceremony and celebration. The 2005 VISION Awards recognized products and services introduced between January 1, 2005 and December 31, 2005 that serve as benchmarks for excellence in several categories within the surface mount industry. Winners of the 2005 VISION Awards include:
Adhesives/Coatings/Encapsulants/Underfills: Indium Corporation of America — NF260 Lead-free, Reworkable, Air-reflowable, No-flow Underfill, which meets the demands of higher solder temperatures in lead-free materials, while providing greater solder rigidity and crack resistance. Assembly Tools: LPKF Laser and Electronics — MicroLine 350 Ci Depaneling Laser System. This system is an automated depaneling and routing system for PCBs that uses laser technology for high accuracy and yield. Cleaning Equipment: Aqueous Technologies Corporation — Self-cleaning Wash Tank, which pumps water at 15 feet per second, sweeping solder paste into a filter where it is contained. The self-cleaning wash tank contains both lead and lead-free solder pastes. Cleaning Materials: Kyzen Corporation — AQUANOX A4630 Cleaning Materials. These materials are said to clean lead-free cost-effectively. In extensive ion chromatography testing, the product reportedly exceeded cleanliness standards for cosmetic solder joint appearance. Device Programming: BP Microsystems — Helix Programming System, which provides the quality of automated device handling at a lower cost. The precision tooling head requires no vision system for handling fine-pitched parts, and features overall increased speed and throughput rates. Dispensing Equipment: Speedline Technologies — Camalot XyflexPro+ Advanced Dispensing System, which is an in-line or stand-alone dispense system featuring an advanced composite gantry design structure and linear drive system that uses the latest in motion-control technology. EMS Providers: EPIC Technologies — Synchronous Flow Manufacturing (SFM) Process. This process can increase customer scheduling flexibility while reducing inventory-carrying costs and capital equipment requirements. Environmentally Friendly Products/Service: Tamura H.A. Machinery, Inc. — FLIP Solder Bath for Lead-free Wave Soldering. Featuring linear induction pumping technology, this product uses 30% less initial solder and generates 40% less solder dross. The absence of motors, impeller shafts, and belts is said to increase machine reliability and uptime. Inspection: ERSA GmbH — ERSA Ecoselect AOI+R, which combines AOI and selective repair soldering. It can perform a fully automated PCB optical inspection and repair for PTH assemblies, and offers first pass yield (FPY) production, no operator dependence, 100% traceability, quality control and documentation, rapid cycle times, and lower operational costs. Mass Soldering Equipment: Specnor Technic Intl. Corp. — Lead-free Retrofit Kit offers a cost-effective means to upgrading existing wave solder machines for lead-free operation. Fully constructed of titanium, the Retrofit Kit is resistant to the corrosive effects of lead-free solders. Passives and Components: AVX Corp. — FlexiTerm Soft Termination System, which is a soft termination system developed as an additional flexible-termination layer for the component to ensure electrical integrity when external forces are applied. Pick-and-Place: Siemens A&D EA — SIPLACE X-Series SMT Machine, which uses ultra-low-mass carbon fiber placement machine gantries and low-mass heads. The machine features smart feeders, a PDA operator interface, and an integrated inventory control system to solve production-control problems. Printing: Speedline Technologies — MPM Accela Printer. This system offers CANOpen Controls for high-volume, ultra-fine-pitch, and lead-free applications. It supports production for automotive, CEM, cellular, industrial, and semiconductor markets, with flexibility to handle a range of applications with user-friendly hardware and software and designed-in reliability. Process Control Tools: Cogiscan Inc. and Juki Automation Systems — IFS-X2 RFID Intelligent Feeder System. This RFID intelligent feeder system features an open architecture and a fully intelligent control system that can track components from initial receipt through placement. Rework and Repair: BeamWorks, Inc. — "Dipping" Process for QFP Replacement Using BeamWorks Spark 400 Laser System, which reduces the standard QFP rework process to four steps. Steps 3, 5, and 7 are skipped, while Steps 5 and 6 are combined, reducing removal and replacement time for QFP from 10 to 3.5 minutes. Selective Soldering: BeamWorks, Inc. — Close Loop Laser Selective Soldering Process with Spark 100. This process uses diode lasers for soldering. The close-loop process monitors the temperature of each solder joint and turns the laser off automatically once the desired temperature is achieved, allowing for laser soldering without concern for damage to boards or components. Software: DEK — DEK Interactiv, an Internet-based support product, delivers the ability to predict and schedule maintenance through remote diagnostics, view machine histories, and gain access to DEK's service control centers. Soldering Equipment: Tamura H.A. Machinery, Inc. — FLIP Solder Bath for Lead-free Wave Soldering features linear-induction pumping technology said to use 30% less initial solder and generate 40% less dross. The absence of motors, impeller shafts, and belts reportedly boosts machine reliability and uptime. Soldering Materials: Kester Corp. — Optimized EnviroMark 907 Lead-free, No-clean Solder Paste is said to produce shiny solder joints through creative application of unique activators that force the solder joint to remain smooth and shiny, even after high-temperature, lead-free reflow profiles in air or nitrogen. Testing: Everett Charles Technologies — Eliminator 6 (E6) electrical test tool, which eliminates test points and scans PCB panels at a rate of up to 3" per second, regardless of PCB density, test-pad size and pitch, or number of PCB images per panel. E6 eliminates expensive test tooling and fixturing, especially for complex circuits."Entries for the VISION Awards program reached new heights for 2005. This clearly demonstrates that innovation is alive and well in the surface mount industry," states Jay Regan, Publisher, SMT Magazine. "As our readers and advertisers broaden their horizons to new geographies, and expand their capabilities, SMT Magazine will be by their side, enabling the transfer of information. Congratulations to all winners of this year's VISION Awards."SMT will spotlight all entrants and award winners in its May 2006 issue. For more information on the 2005 VISION Awards, please visit www.smtmag.com.