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SMTA International Call for Papers Opens
February 15, 2006 |Estimated reading time: 1 minute
MINNEAPOLIS — The SMTA International Technical Committee has opened its Call for Papers for abstract submission for SMTA International 2006, to be held September 24–28, 2006, in Rosemont, Ill. Short course descriptions are also being solicited.
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic, or appropriate test data. Material should be original, unpublished, and non-commercial in nature. Papers of interest include:
Emerging Technologies: New materials and processes; consumer applications; system-in-package; MEMS/MOEMS; optoelectronics; wireless applications, including Bluetooth and Wi-Fi; nanotechnology; 0201 components and assembly; and getters.
Components: BGA; battery interactions; CSP, including wafer-level packages; component solderability, component reliability; connectors; embedded passives; failure analysis; fine-pitch technology; flip chip/direct chip attach; harsh environments; lead/termination finish; leadless packaging; and multichip packages, including 3-D packaging.
Assembly: Adhesives; BGA/CSP assembly; cleaning, connector technology; DFX/design for Six Sigma; dispensing, equipment selection; facility layout; flux and solder; land pattern design; lead-free soldering (including case studies); lean manufacturing; low-volume/prototype assembly; medical electronics; moisture sensitivity; placement; printing; reflow soldering; rework and repair; selective soldering; setup reduction; solder paste; supplier engineering; wave soldering; and yield improvement.
PCB Technology: Black pad; embedded passive and active components; HDI; microvias (filled and unfilled); soldermask; substrate reliability; substrate solderability; and surface finish.
Process Control: AOI; CIM; in-circuit test; process modeling; software; test strategies; and X-ray.
Business: Capacity modeling; contract manufacturing; doing business in Asia; environmental issues; lean manufacturing/quality initiatives; operations management; remaining competitive; RoHS compliance; supplier management; and technology roadmaps.
The deadline for abstracts is February 24, 2006. Please be sure to obtain approval to both write and present a paper prior to submitting an abstract. Please submit abstracts online at www.smta.org/smtai/call_for_papers.cfm.