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Materials Science Program Addresses Reliability Concerns
December 31, 1969 |Estimated reading time: Less than a minute
When speaking with electronics assemblers, Indium Corporation of America discovered there are many challenges to overcome, including thermal management issues resulting from increased power demands and component miniaturization. Solder joint reliability was the #1 concern for assemblers, said Ross Berntson, director of solder products. In response, Indium Corporation developed its Materials Science Program for Reliability.
This comprehensive suite of solutions includes products, services, and technologies to help engineers develop optimized, reliable products. Products included in the reliability program include the Indium5.1 lead-free, no-clean solder paste which addresses via-in-pad voiding issues and CSP printing for surface mount reliability; wave solder products to alleviate incomplete barrel fill with lead-free alloys for PTH reliability; no-flow underfill that address joint cracking due to brittle lead-free alloys and reduced-size joints; and thermal interface materials. Indium also gives users access to its SMTA-certified process engineers, the company's around-the-clock online interactive technology database, and its online lead-free readiness assessment software. Program technologies include no-flow underfill materials and process technology, pin-in-paste+ materials and process technology, Via-in-Pad solder joint performance optimization technology, and thermal interface materials and process technology.