-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Distributor to Premier Lead-free Products at APEX '06
January 30, 2006 |Estimated reading time: 1 minute
LOS ANGELES — Distributor all4-PCB (North America) will introduce new lead-free products at the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, to take place February 8–10, 2006, in Anaheim, Calif. These products are said to be making their first North American trade show appearance.
The Penta 580 lead-free hot-air solder leveling (HASL) machine is manufactured by Germany-based Pentagal, and conforms to the ban on lead soldering equipment scheduled to go into effect throughout Europe in 2006. Also, the PRS 77 optical lay-up, registration, and bonding system for preparation of lamination stacks from New York-based DIS claims to greatly increase layer-to-layer registration over current solutions.
Other products slated for introduction include the PM 650 orbital sanding machine for via fill technology from Pola & Massa, which demonstrates an ability to conform to uneven surfaces, reportedly allowing for much higher tolerance manufacture. The PM 650 is complemented by the VCP via filling equipment from MASS Germany, also on display, which provides for filling of pastes into vias through via-in-pad technology. This conductive interconnect to the surface feature of the pad in different board layers takes place in the pad rather than on the surface of the board, thus removing any connective paths on the surface of the circuit board.