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Image Processor Software Optimized with SMT/BGA Capabilities
January 26, 2006 |Estimated reading time: Less than a minute
SAN DIEGO — Adding to the Verifier Image Processor (VIP) Application Software series, FocalSpot introduced the VIPx, featuring an extended set of advanced SMT/BGA inspection capabilities and image enhancement tools.
VIPx is a PC/Windows XP-based image processor that delivers solder joint-, package-, and PCB-level diagnostic software capabilities for enhanced visualization, precise measurement, and user-defined analysis of SMT/BGA solder joints, PCBs, components, mechanical parts, and electrical interconnections. VIPx is suitable for upgrading most X-ray inspection systems with PC-based functionality.
The BGA analysis module finds BGA connections automatically and measures ball diameter, area, void, and solder amount. Rules can be set to find bridging, opens, voids, no- or low-solder areas, and poor reflow. The SMT analysis module finds and measures the solder area, voiding, and solder amount automatically. Rules can also be established for defect detection. The custom analysis module will draw out irregularly shaped objects or regions of interest with the mouse to measure solder and void content. The package analysis module measures wire sweep and wire-loop heights, while the PCB analysis module measures drill offset and inner-layer mis-registration. X-ray images can be sharpened, relieved, colored, and plotted three-dimensionally using the image enhancement analysis module.