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Henkel Materials Specialist to Speak at SMTA Toronto
January 13, 2006 |Estimated reading time: 1 minute
MINNEAPOLIS — On January 18th, the Electronics Group of Henkel's Dr. Brian Toleno will speak at the upcoming SMTA Toronto, Canada Chapter meeting, sharing basic information such as the definition of underfills and their function, and more detailed data regarding design rules, reliability, and standards.
"We are delighted that Dr. Toleno is speaking to the SMTA's Toronto Chapter," says Bev Christian, vice president of Technical Programs for SMTA's Toronto Chapter. "One of the SMTA's charters is continuing education, and we are honored that Dr. Toleno will share his vast materials expertise with our members."
In his current role as Application Engineering Team Leader at Henkel, Dr. Toleno is responsible for overseeing applications work for the company's electronic assembly products, including solder paste, liquid flux, conformal coating, potting, surface mount adhesives, board-level underfill, and thermally conductive adhesives. He has a B.S. in Chemistry from Ursinus College, and received his Ph.D. in analytical chemistry from Penn State University. Prior to joining Henkel, Dr. Toleno managed the failure analysis laboratory at the Electronics Manufacturing Productivity Facility (EMPF). He is an active member of the SMTA, has served as the Program Chair for the 2005 IEMT, and currently serves as the IPC's Underfill Handbook Committee (J-STD-030) chairperson and co-chair of the Solder Paste Standards Committee (J-STD-005). Dr. Toleno also has developed a course on failure analysis for SMTA, has authored numerous technical features for trade journals and peer reviewed publications, and has written two chapters for electronic engineering handbooks on adhesives and materials.
For more information, or to register for this event, please contact Bev Christian at (519) 888-7465, ext. 2468, or bchristian@rim.com.