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Photo Stencil to Present Papers at APEX
January 11, 2006 |Estimated reading time: Less than a minute
COLORADO SPRINGS, Colo. Photo Stencil will present two papers at the IPC Printed Circuits Expo, APEX, and the Designers Summit in Anaheim, Calif., February 8-10, 2006.Bill Coleman, Ph.D., vice president of technology at Photo Stencil, will present "Step Stencils," a discussion on the technologies required by demanding SMT environments. Thick metal stencils, electroform step-up stencils, and 3-D electroform stencils are some evolving solutions within the industry. These applications and the stencil design used to achieve an optimum solution will be discussed on February 8, 2006, from 1:30-3:00 p.m.
Mike Burgess, stencil product manager, Photo Stencil, will present "Lead-free Solder Paste Printing: Stencil and Squeegee Blade Impact," on February 9, 2006 from 1:30-3:00 p.m. The paper will focus on the stencil and squeegee blade and their affect on lead-free solder paste printing. Three stencils, three lead-free solder pastes, and five squeegee blades will be included in the discussion.