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New Substrate Technology Offers High Thermal Conductivity
December 8, 2005 |Estimated reading time: Less than a minute
CORPUS CHRISTI, Texas — TT electronics IRC Advanced Film Division's Anotherm substrate technology consists of a thermally conductive aluminum alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen printed conductors applied to the anodized layer. It is said to offer benefits over conventional, polymer-based insulated metal substrates (IMS).
Anotherm reportedly uses low-cost manufacturing methods, resulting in compatibility with SMT assembly. The base aluminum substrate offers high thermal conductivity, so in many cases, Anotherm eliminates the need for additional heatsinks. Anotherm chemically converts the surface of the base aluminum itself to a rugged, anodized insulating layer with a 35-µm uniform thickness, eliminating potential delamination or peeling. Anotherm's additive process is said to have fewer process steps than the subtractive process typically used for IMS board manufacturing. Suitable applications include high-brightness LED assemblies, LED packages and power resistors for automotive applications. Maximum operating voltage is 250 VAC, with thermal impedance at 0.2°C/W. Maximum continuous operating temperature is 400°C without a solder mask, and 175°C with a solder mask.