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Advanced Circuits Adds Lead-free Plating Finish to Offering
December 2, 2005 |Estimated reading time: Less than a minute
AURORA, Colo. — Advanced Circuits now offers lead-free solder as a plating finish, providing an enhanced solderable finish for assembly that meets all legislation requirements for the European Union's RoHS Directive deadline of July 1, 2006.
"As an innovative and customer-centric company, we focus on determining designer and industry needs well before they become a pressing issue," says Tony Garramone, corporate training manager at Advanced Circuits. "We strive to stay ahead of the curve and provide our customers with the most current technology. We've accomplished this and are excited to offer our customers lead-free options far before requirements mandate."
Advanced Circuits produces their lead-free boards using a lead-free alloy of 99.3% tin and 0.6% copper with a trace of nickel (SN100CL). This solder is said to provide a flatter pad surface than its leaded counterpart. Advanced Circuits is also stocking various higher-temperature laminates to use with the lead-free solder finishes, which are designed to withstand processing temperatures between 260° and 288°C. The new lead-free solder is also compatible with other leaded solder components.