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SOIC Package Qualifies for Lead-free Manufacturing
November 29, 2005 |Estimated reading time: Less than a minute
IRVINE, Calif. — A lead-free SOIC package from the electronics group of Henkel that integrates the company's GR828H mold compound with the Hysol QM1519 die-attach adhesive has received customer qualification. Designed for 16- and 14-lead SOIC packages, the material is said to combine the molding characteristics, high productivity and low-wire-sweep properties of the GR282H with the adhesive strength of the Hysol QM1519.
Using a Cu/Ni/Au leadframe, the materials have met testing for optimal compatibility and can withstand operation in specific climates. The package achieved MRT reliability for MSL L1 up to 260°C, with CSAM images indicating that no delamination had occurred at the die top or the page. High-temperature storage conditions testing showed 0% failure for up to 3,000 hours at 210°C.