-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
iNEMI Issues 2005 Research Priorities
November 16, 2005 |Estimated reading time: 2 minutes
HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) announces the release of its 2005 Research Priorities, a document that presents the consensus on R&D needs identified in the 2004 iNEMI Roadmap. It intends to help the electronics manufacturing industry focus efforts on those areas and issues that are critical to future competitiveness.
"The 2004 iNEMI Roadmap indicates that most of today's key semiconductor and electronic packaging technologies are not capable of meeting the needs of the industry in 2015. If these challenges are not promptly addressed with innovative solutions, the continued viability of the electronics manufacturing industry will weaken over the next decade," says Robert C. Pfahl Jr., iNEMI's vice president of operations. "The iNEMI Research Priorities help focus attention on the critical areas that will yield the greatest return on research investment."
The 2005 iNEMI Research Priorities are part of iNEMI's proven planning methodology, which ensures that its members focus on high-impact areas where they can make a difference in the marketplace. This process involves five basic steps:
1. Create industry roadmaps by drawing upon the expertise of a broad cross-section of individuals from industry, academia and government. The results of this work are open to the electronics industry worldwide.2. Identify the major areas on which iNEMI will focus deployment efforts, based on need, participation and ability to make a business impact.3. Conduct a gap analysis on each of these major areas to identify the key challenges and opportunities facing the industry.4. Create five-year plans that identify the projects and activities deemed necessary to close the gaps identified for each of the major areas. These plans become the basis for the formation of iNEMI deployment projects.5. Develop a 10-year vision of research needs to ensure a vibrant, innovative electronics industry by prioritizing the research needs identified in the iNEMI Roadmap.
The prioritized research needs and options are the core of the iNEMI Research Priorities, and are distributed as resource materials for industry, research institutes and funding agencies. The 2005 Research Priorities discuss technology needs by product sector (consumer/portable, large business systems, automotive, aerospace/defense, medical and netcom — networking, telecommunications and data communications), and summarize research priorities by research area (manufacturing process, system integration, technology integration, energy and the environment, materials and reliability, design).
Six key challenges identified by the 2004 iNEMI Roadmap, and discussed in the 2005 Research Priorities are (1) strategic gaps in active device technology; (2) thermal management; (3) increased communications bandwidth; (4) next-generation packaging technology; (5) design and simulation tools; and (6) sustainability metrics. Evolutionary gaps identified include manufacturing challenges from miniaturization and materials reliability. Of these six key challenges, an issue of paramount importance to the industry is next-generation packaging technology. Every few decades, the electronics industry introduces a new generation of packaging technology that significantly changes product design, manufacturing/assembly processes and system interfaces, and requires several years to fully implement. For more information on the 2005 iNEMI Research Priorities, please click here.