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New Products
December 31, 1969 |Estimated reading time: 5 minutes
Thermal Profiler
OvenRIDER NL profiles convection reflow oven capabilities, separating zonal temperatures from convection efficiency while verifying conveyor speed for lead-free oven-performance consistency. With a height of 23.1-mm above the chain conveyor, the profiler eases clearance through nitrogen-inerted and low-tunnel ovens. Featuring on-board Statistical Process Control (SPC) quality assurance tool requires no attached thermocouples; and daily use provides SPC charting control and Cp and CpK capability indices. The profiler combines thermal and position sensors to measure oven performance, delivering color-coded data that can identify trends while serving as a “go/no-go” indicator. ECD, Portland, Ore.
Thin Film Inductor
The L0402 thin film inductor is said to offer high Q and tight tolerances with high-current handling capability and repeatability. Land grid array (LGA) packaging provides high-frequency performance and rugged construction for automatic assembly in mobile communications, satellite TV receivers, GPS, vehicle location systems, WLANs, filters and matching networks. Low-profile LGA packaging solders and dissipates heat well, while allowing for self-alignment during reflow. Inductances range from 0.82 to 6.8 nH. AVX Corp., Myrtle Beach, S.C.
Micro-pitch Interconnects
The BTH/BSH and LTH/LSH series sub-millimeter micro-pitch interfaces on 0.5-, 0.635- and 0.8-mm pitch feature traditional blade-and-beam construction. The 0.5-mm-pitch systems are available for 0.5-mm-board spacing and low-profile applications with 2.31-mm mated height. Higher-profile connector sets offer pin counts up to 360 in 775 mm2 of board space, while lower-profile options offer up to 100 I/Os in 185 mm2 of board space. For applications requiring less density, the QTS/QSS series 0.635-mm-pitch and BTE/BSE series 0.8-mm-pitch systems are available with up to 300 and 240 I/Os, respectively. Board spacing ranges from 5 to 19 mm for elevated applications. Samtec, Inc., New Albany, Ind.
Modular Conveyor System
The SM-700 modular conveyor system for PCB transport is available in belt widths from 6" to 30" and lengths from 5’ to 40’. Features include a modular, ESD-compliant belting system, variable-speed DC drive motor and 1"-tall removable side rails. A passageway system lift gate allows for continuous product flow. When the gate is lifted, the belt shuts down and allows for passage through the line. PRO-MATION Inc., Kenosha, Wis.
ASSEMBLY TOOLS & EQUIPMENTElectrostatic Fieldmeter
The FMX-003 electrostatic fieldmeter isolates and solves static problems in applications with static-charge-generation potential. The fieldmeter measures static voltages within ±22 kV at a 1" distance, displaying results numerically or in bar-graph format. Push-button operation includes power on/off; zero adjustment; ion balance; and hold. Simco, an Illinois Tool Works Company, Hatfield, Pa.
COMPONENTSTerminal Blocks
EuroMax high-power, two-piece pluggable terminal blocks offer up to 85 A per circuit at 600 V for motors and drives, process controls, electrical-energy controls and load-control systems. Available in horizontal plug and right-angle header versions, the blocks feature a parallel-contact system and copper-based hardware components to optimize thermal compatibility. A high-temperature housing material can withstand lengthy solder pre-heat conditions. The header blade features three PCB tails for robust connection. One-piece terminals also are available. Molex, Lisle, Ill.
High-speed Photocouplers
A family of high-speed SO8 photocouplers and isolated driver devices include 1-, 15- and 25-Mbit/s devices in single-channel modes, and 10-Mbit/s devices in single- and dual-channel modes. Each photocoupler uses an industry-standard footprint and incorporates optimal noise immunity, higher heat resistance and improved isolation characteristics. In a surface mount configuration, the series targets applications requiring standard surface mount, 8-pin packages, such as plasma display panels, digital audio amplifiers, power supplies, digital field busses and high-speed logic. The devices feature isolation temperatures of 3.75 kV and operating temperatures from -40° to +100°C. Sharp Microelectronics of the Americas, Camas, Wash.
DISPENSING EQUIPMENTDispensing System
DispenseLink II dispenses dot arrays, lines, fill routines and custom patterns. PLC controls provide single-dispense programming for RPM, index and acceleration. The system also integrates with standard dispensing platforms or XYZ robotics systems. Features include password security, mounting hardware, 5-m cables and a digital-pressure gauge. A brushless motor with a programmable encoder controls auger rotation and provides more than 57,000 counts per each full revolution, allowing the valve to dispense down to 0.005". DL Technology, LLC, Haverhill, Mass.
HARDWARE/ACCESSORIESGraphite Heatsinks
eGraf HS-400 graphite composite material-based heatsinks are suitable when aluminum cannot meet power-dissipation requirements and copper is too heavy. Available base-design types include copper base/graphite fins; copper base with heat pipes/graphite fins; aluminum base/graphite fins; and aluminum base with heat pipes/graphite fins. With a density of 1.9 g/cm3, thermal-sink conductivity exceeds 370 W/mK because of anisotropic properties - allowing for even heat distribution in two dimensions. To maintain its lightweight properties, graphite fins are bonded to the base of the heatsink with thermally conductive epoxy. GrafTech International, Cleveland, Ohio.
Surface Mount Fuses
Produced in 1206 chip sizes, a series of RoHS-compliant, slow-blow surface mount fuses offer high reliability and strong arc-suppression characteristics. Intended for DC-power applications up to 63 VDC, the fuses provide overcurrent protection on systems that experience frequent current surges. Available in values from 1.0 to 8.0 A, the fuses target power-supply protection, capacitor-filter banks, LCD backlight inverters and electric motors. A monolithic, multilayer design enhances high-temperature performance in various circuit-protection designs. The fuses feature operating temperatures from -55º to 125ºC, and can withstand soldering temperatures up to 260ºC for 60 sec. maximum. Raychem Circuit Protection, a business unit of Tyco Electronics, Menlo Park, Calif.
MATERIALSSilicone Compound
A single-component, non-corrosive silicone-elastomer compound targets bonding, sealing, coating and formed-in-place gaskets. Designed for service up to 400ºC, MasterSil 800 is a self-leveling, free-flowing, low-viscosity material that can fill small crevices and voids. It is said to exhibit a tack-free time of 20 min. at ambient temperatures, cures in cross-section thicknesses up to ¼" and adheres to many metals and plastics without a primer. Master Bond Inc., Hackensack, N.J.
Gold Recovery
GOLDOUT recovers 99.4% of gold from spent gold etchant with minimal health and safety risks. When mixed in water, GOLDOUT has a pH of 7.9, rendering the spent etchant less hazardous than other gold-recovery chemicals with lower pH levels. The material is designed to complement iodine-based gold etchant. Union Etchants International Inc. (UEI), Woburn, Mass.
Flexible Epoxy
Duralco 125 is an electrically conductive, two-component flexible epoxy that forms bonds for continuous use at 400ºF. It is said to adhere to dissimilar substrates while exhibiting thermal, mechanical and chemical shock resistance; and cures at room temperature for high-bond strength. Dispensable using a handheld applicator, target applications include flexible circuits, solder replacement, semiconductor bonding, EMI shielding, wire taking, bonding thermistors and assembling heating elements. Coefficient of thermal expansion is 3.4 × 10-5/°C Cotronics Corp., Brooklyn, N.Y.