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Indium to Show WEEE/RoHS-compliant Offering at Productronica '05
October 20, 2005 |Estimated reading time: Less than a minute
UTICA, N.Y. — Indium Corp. will display its lead-free electronics assembly materials for WEEE and RoHS compliance at the Productronica show in Munich on November 15–18, 2005, and Indium's booth will be located in A3-550. Such new assembly materials will include its NF-260 reworkable lead-free no-flow underfill and Indium 5.1 no-clean solder paste. Other product offerings to be shown include Indium3.1 water-wash solder pastes; solder preforms in tape-and-reel packaging; wave solder flux for lead-free mixed technology; and rework and repair materials.