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Speedline Receives Patent for Bridge Detection Method
October 14, 2005 |Estimated reading time: 1 minute
FRANKLIN, Mass. — Speedline Technologies has received U.S. Patent #6,891,967 for its MPM BridgeVision inspection method. Awarded for its innovative analysis technique used to quantify both the amount and geometry of solder paste between printed deposits, the technique uses the solder paste's texture to identify its position relative to the smooth pad and solder mask. This method shows the difference between the gray solder paste and the dark solder mask.
Dave Prince, the technique's inventor, states, "This innovation provides a very precise method to both identify and quantify any paste that has found its way to the area between the freshly printed pasted deposits. By building off our previous patented methods for using texture as the basis for segmentation, we have found a way to derive data for SPC tracking which can then allow for intervention either by the operator or automatically when a bridging potential exceeds the control limits."
This tool reviews devices that have the highest tendency to bridge, using that information for process improvement, which is particularly useful for the lead-free transition. Some lead-free pastes have less tendency to migrate back to the pad during reflow, so early identification that leads to prevention of bridges is even more important for these paste formulations.