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Indium's Weiping Liu Joins International Scientific Advisory Board
October 11, 2005 |Estimated reading time: Less than a minute
CLINTON, N.Y. The American Welding Society, ASM International and the International Brazing and Soldering 2006 organizing committee have invited Indium's Weiping Liu, Ph.D., a research metallurgist, to join the conference's International Scientific Advisory Board.
Liu was selected for his international perspective and expertise in the field of brazing and soldering. "Scientific and engineering contributions will greatly add to the overall technical success of the program and directly benefit the advancement of brazing and soldering science and technology," said conference co-chair, F. Michael Hosking of Lui's appointment. The 3rd International Brazing and Soldering Conference (IBSC) will be held April 23-26, 2006, in San Antonio, Texas.
Lui received his Ph.D. in 1989 in Materials Science and Engineering from the Harbin Institute of Technology, China. He performed his post-doctoral work at the Technical University of Berlin, Germany and was awarded the American Welding Society's Masubuchi Award in 204 for "outstanding scientist under the age of 40." Lui has published more than 65 research papers regarding materials joining and laser beam processing.