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Conferences Abound But One Stands Out
December 31, 1969 |Estimated reading time: 2 minutes
By Gene Weiner
Fall and spring used to be known as the meeting and show seasons. Now with the addition of many new shows around the globe, Webinars and the "flattened world," we have an overload of oft-repeated data and technology. Much is old news, yet there are a few gems still out there.
Filling two halls of the new exhibition center, the September NEPCON show in Shenzhen, China was well attended. Foreign producers and local reps displayed the latest improvements for assembly and test in Hall 2. Each company was promoting its version of a lead-free solution. Hall 3 was filled with Chinese suppliers. The equipment was often sophisticated, competitive to and emulating that of Western origin (which is usually patented) and was less expensive. Some Hall 2 exhibitors were grousing that they were effectively forced into subsidizing Chinese competitors that copied their equipment by paying up to four times more for show floor space.
Assembly Tech appeared to be light on attendance, but strong on sales opportunities, according to exhibitors. Visitors to Tokyo's assembly equipment show noted that Protec is quite slow and most of the business for equipment makers here is down. Yet amidst all this was a shining jewel.
Over 110 participants comprised of senior executives from suppliers, fabricators and assembly companies attended an industry exchange hosted by Motorola on "Emerging Miniaturization Technologies," in Schaumburg, Ill., on September 22, 2005. Dr. Iwona Turlik, corporate vice president of Motorola was keynote for the event. Turlik spoke on "...the need to do the impossible." Dr. Aroon Tungare, director of Microminiaturization, Motorola Labs and John Shurboff, manager PCB Design Centers, Motorola Mobile Devices presented "The OEM View, PWB Level Integration Challenges and Roadmap."
Kim Hyland, Solectron's director of process engineering spoke on "Miniaturization Assembly," while Ron Huemoeller, Amkor Technology vice president of worldwide supplier technology and quality engineering presented the semiconductor view of, "Emerging Packaging Technologies, Challenges and Roadmap Requirements."
The powerhouse presentations of the first phase of the interchange, chaired by Dr. James J. Hickman of Hickman Associates, stimulated many attendees to rethink their own company activities, strategies and future product plans. The second part of the program focused on abilities and gaps. Jody Williams of Taiyo America, Mike Carano of Electrochemicals, Jeff Timms of Siemens Logisitics and Assembly, Brian Toleno of Henkel, Ed Kelley of Polyclad Laminates and Matthew Moynihan of Rohm & Haas under the chairmanship of David Rund, president of Taiyo America were on-hand for brief presentations, a panel discussion and a Q&A on a wide variety of topics.
The event, produced under the sponsorship of IPC's Suppliers Council Steering Committee was, in my opinion, the most useful and effective meeting of the past few years. There was something of value for every attendee. All participants asked if another such event could be planned for 2006.
Gene Weiner, president, Weiner and Associates, Inc., may be contacted at (203) 797-9103; e-mail: gene@weiner-intl.com.