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Henkel to Display Environmental Product Suite at Productronica '05
September 21, 2005 |Estimated reading time: 1 minute
IRVINE, Calif. — The global transition to lead-free is propelling the electronics group of Henkel to exhibit its comprehensive lead-free product range at Productronica 2005, to be held November 15–18, in Munich. Henkel's lead-free offering will include a range of product and material sets, to be shown at booth A3.153 in Hall A3. Such products include Multicore solder paste, flux and wire solutions and Loctite surface mount adhesives, all of which withstand lead-free wave soldering while preventing chip loss. Also to be shown are Hysol underfills, dam and fill encapsulants, die attach adhesives and semiconductor molding compounds, which all optimize elevated lead-free process temperatures.
As the race against time to go lead-free begins, Henkel's inclusion of the successful Team McLaren Mercedes MP4-20 Formula 1 car on its stand is particularly appropriate. The Henkel-sponsored vehicle will be on show for the duration of the event. Attendees will find out how the car is able to withstand the demanding conditions of today's F1 circuits, while also learning how their processes can stand up to the demanding conditions of the new lead-free environment. With more than 100 different applications on the car, Henkel is proud to have contributed to the success that Team McLaren Mercedes has achieved this year.
Henkel will use Productronica 2005 to showcase its streamlined, cost-effective material sets capability. "The imposition of environmental concerns does not remove the need to continually decrease manufacturing cost and maintain fast product development cycles for consistent product reliability and compatibility," comments Frank Ongkiehong, director of application engineering/marketing in Europe. Henkel's stand also will feature a Macromelt technology demonstration, illustrating exactly how this low-pressure molding technique is ideally formulated for encapsulating fine or fragile circuitry. Henkel's Macromelt polyamide materials allow for a self-contained and highly integrated assembly, eliminating the need for casings or enclosures, multiple assembly processes and gasketing or sealing issues.