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ATExpo to Feature Cleaning Optimization Paper Presentation
September 7, 2005 |Estimated reading time: Less than a minute
AUSTIN, Texas — Austin American Technology's Steve Stach and Kyzen Corp.'s Mike Bixenman will co-present a paper entitled, "Optimizing Cleaning Energy in Batch and In-line Cleaning Systems — Phase Two" in technical session SMT2 at the Assembly Technology Expo (ATExpo) on Tuesday, September 27, from 1:30 p.m. – 3:00 p.m. in Room 5. The session is titled "Post Assembly Cleaning of the Circuit Board — New Concerns, Requirements and Development," and will be chaired by Tom Borkes, the Jefferson Project, and co-chaired by Don Swenson, Honeywell.
At the SMTA 2004 tech forum, Stach and Bixenman presented research for optimizing cleaning energy in batch and inline cleaning systems. Phase Two of this research tests the process cleaning rate equation, which equals the static cleaning rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) using spray-in-air cleaning equipment. The baseline for this experiment establishes the solubility rate of the cleaning solution, at static conditions, to determine the dissolution rate of flux residue at a pre-determined cleaning chemistry concentration and temperature. For more information, please visit www.atexpo.com.