SMT China International Call for Papers

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SHANGHAI - PennWell and China Electronics Appliance Corporation (CEAC) will sponsor the 2005 SMT China International Conference on “Emerging Technologies and Lead-free Challenges,” November 21-22, 2005. This 3rd annual conference will take place at the Shanghai International Convention Center, Shanghai, China, in conjunction with the CEAC’s 66th China Electronic Fair (CEF). SMT and SMT China magazines announce a call for papers for this conference on topics such as high-density, fine-pitch placement; equipment modular design; process optimization programming; 0201, 01005 components; SMT applications in automotive and medical electronics; as well as several SMT, emerging technologies and modern assembly method topics.

Papers from environmental managers and technical experts are sought on relevant subjects. For a complete list of relevant topics, visit http://downloads.pennnet.com/pnet/misc/smt/shanghai 05_cfp_form.pdf. Abstracts should be 300 words in length and include an attached abstract submission form and a brief author biography. The deadline for abstract submission is September 25, 2005. Presenters will be allotted 40-minute time slots for their presentation and discussion. Simultaneous Mandarin and English interpretation will be provided. Some papers may be grouped in a forum or panel discussion. Speakers will receive discounted admission to the conference, a copy of proceedings and refreshments and luncheon. For more information, e-mail Gail Flower at Gailf@pennwell.com or Charlie Zeng at charliesmt@sina.com.