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2005 SMTA International Products
December 31, 1969 |Estimated reading time: 8 minutes
Following is a variety of products offered from just a few of the exhibiting companies slated to be at SMTA International/ATExpo. Be sure to visit each exhibiting company for more complete product offerings.
Tin/Lead Paste
Multicore MP218 tin/lead paste is suitable for manufacturers who must use tin/lead pastes together with lead-free terminated components and board finishes. A halide-free, no-clean formulation, the MP218 is pin-testable and offers broad process windows for printing and reflow. The material also exhibits high resistance to humidity for global manufacturers wishing to qualify a single solder paste that performs within varying assembly environments. Multicore MP218 is also available in alloy 63S4, where anti-tombstoning properties are desirable. Henkel Corp., Irvine, Calif.
Thermal Protection Devices
ALPHA CoolCap thermal protection devices cool components and semiconductor packages during high-temperature lead-free reflow and rework processes, providing protection without investing in process changes and redesign. The reusable, custom-fitted caps keep semiconductor packages below 245° or 260°C, and minimize temperature variation within packages from over 10°C down to 2º to 5°C, minimizing warpage, popcorning and delamination. Suitable for no-clean, water-soluble or RMA processes as a temporary heatsink, the devices can be placed on components by hand or with pick-and-place equipment, requiring no adhesive. Cookson Electronics Assembly Materials, Jersey City, N.J.
Reflow Oven
The RO400FC full-convection reflow oven targets small- to mid-size volume productions. Using full convection to heat PCBs homogenously, the RO400FC is suitable for lead-free solders. Its convection technology uses vertical laminar flow, offering efficient heat transfer with low ∆T values. Three preheat and one peak-zone temperature, as well as the closed-loop-controlled conveyor speed, are fully programmable. Zone temperatures are measured within the airflow at the board height to ensure reproducible soldering conditions. A universal mesh belt or optional precise-chain conveyor transports single- or double-sided boards up to 400-mm wide. Other features include a full convection oven for even temperature distribution, high air volume for low thermal stress of components, vertical laminar flow, closed-loop conveyor drive system, easy profile selection and optional flying thermocouple. Targeting standard or lead-free soldering, the RO400FC features an integrated microprocessor control or computer-control option, an optional SMEMA interface, profiling software and built-in security switches. ESSEMTEC, Glassboro, N.J.
Assembly Solution
Horizon 01i is a high-speed solution said to meet high-mix/high-volume assembly challenges, including 0201 and CSP packages. With Cpk 2.0 at 25 µm and a 10-second cycle time, this system also features the Instinctiv user interface, Interactiv Web-based support service and optional 1,200 mm2∕s Hawkeye print verification system for fault identification and response. DEK International GmbH, Flemington, N.J.
Selective Soldering Solution
The Firefly selective soldering solution is said to maximize flexibility and address problems associated with lead-free alloys. Each thru-hole component or surface mount device can be soldered without dedicated, protective masks. During solder joint formation, the thermal process does not affect nearby components and substrates. Soldering is executed from the bottom side of the board, without inversion prior to soldering. The laser soldering process reportedly produces a high-quality solder joint with minimal thermal stress. Automatic programming imports one or more CAD data files of the board, while manual programming uses the integrated CCD camera. Seica S.p.A., Strambino, Italy.
Miniature Imager
The Quadrus MINI mega-pixel imager reads both linear bar codes and 2-D codes on boards and components. Measuring 1.8" × 2.10" × 1" and weighing less than 2 oz., its hi-res optics provide a wide-scan window for reading any code at close range or in tight spaces. The reader can be embedded inside pick-and-place robotic equipment, or mounted at the entrance and exit points of work cells for process verification. Featuring a mega-pixel sensor with an extra-wide field of view and proprietary algorithms, it reads long bar codes omni-directionally, as well as high-density 2-D symbols. Customizable data output and a Windows-based interface facilitate integration into existing operating platforms with minimal programming. Microscan Systems, Inc., Renton, Wash.
Test Probe System
The multi-faceted MTS500 CONDOR test probe system features rapid program development, high throughput and the ability to handle large PCBS (up to 24" × 28"). With four identical flying test probes and more than 1,000 fixed pins, the CONDOR also features a SMEMA-compatible conveyor. By riding on a frictionless air-cushion system, the test heads enable nearly maintenance-free X/Y positioning. Digitaltest GmbH, St.-Blankenloch, Germany.
Rework System
The Summit 1800 rework system reportedly addresses difficult rework challenges such as lead-free rework for large components. A 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. Programmable, motor-controlled top-heater positioning, with independent pick-up motion provides process flexibility. An automatic prism shuttle facilitates accurate, repeatable component alignment. The component pick-up tube features 360°-theta control and automatic alignment height, ensuring proper focus and image magnification of components. With standard board handling of 18" × 22", 0.0005" to 0.001" placement accuracy and magnification capability from 2 to 40×, options include manual scavenger, component-print station, cooling boost, sliding board support, a 17"-LCD monitor and a 22" × 30" board-size upgrade. VJ Electronix Inc., Shirley, Mass.
Direct Die Feeder
The latest addition to the Direct Die Feeding product line, the DDf Ultra, can feed a range of bare die and flip chips in high throughput. Complementing the DDf, the DDf Ultra is optimized to handle small flip chips, including die down to 0.5 mm2 with a throughput greater than 6,000 die/hour; and can be mounted to most placement machines. Capabilities for smaller die sizes and higher throughputs are planned. Semiconductor Feeding Solutions Group of Hover-Davis, Rochester, N.Y.
Selective Soldering System
The Opus 3 is a four-axis Cartesian robot targeting selective soldering of thru-hole and odd-form components into surface mount and mixed-technology PCBs from the bottom side - without inverting the PCB. Incorporating Gaussian solder wave technology, the Opus 3 is a tool-less system for most soldering applications. An optional tilt axis provides the peel-back found on conventional wave-solder systems to ensure bridge-free terminations. Features include an adjustable board holder, spray fluxer, solder module and vision-assist video for setup and process monitoring. Featuring intelligent spray/ultrasonic/drop-jet fluxing, the system is designed for in-line processing or batch operation, and is easy to program with instant changeover. Tyco Electronics Automation Group, Willow Grove, Pa.
Compact Rework System
The Fineplacer CRS10 is a compact rework system designed for customers requiring a fixed configuration. The system features quick setup and easy operation, targeting small- to medium-scale series assembly or precise rework of soldered components on medium- to large-size SMD boards. Applications include BGA, CGA, CSP, micro-BGA, MLF, WFP, TSOP, PLCC, small components, RF shields, shielding frame, flip chip rework and customized applications. Featuring a Plug-and-Work design, the system eliminates the need for cabling. Other features include a patented Vision Alignment System (VAS) design with stationary beam splitter, controlled Z-height during reflow, lead-free-compatible rework and an automated component place and lift-off function. A Controlled Mixed Soldering System (COMISS) reflow module enables top heating and high-performance full-area bottom heating. With better than 10-µm placement accuracy, the CRS10 can be used for components with pitches down to 100 µm. A large field of view also aligns large components with side lengths up to 45 mm without additional optics. Finetech Inc., Phoenix, Ariz.
Cleaning Solvent
Designed to clean lead-free materials while providing a low cost of ownership, AQUANOX A4630 offers ambient temperatures, low concentrations and an MEA-free-designed material. Typically used in aqueous spray-in-air equipment at 10 to 20%, from ambient temperatures and without the use of slump-side additives, the cleaner provides brilliant joints throughout an extended bath life and is effective on all no-clean materials. Kyzen Corp., Nashville, Tenn.
Lead-free Paste
GREEN PASTE8 helps eliminate cross contamination between leaded and lead-free boards in a mixed-production environment. Because it is visually green, the paste allows operators to distinguish it from standard, gray-colored Sn/Pb paste. The color remains until reflowed, leaving a metallic-joint appearance. Residues are clear, but glow under black light to identify lead-free boards after assembly. Qualitek International, Inc., Addison, Ill.
Lead-free Solder Paste
EnviroMark 909 (EM909), a lead-free, soft-residue, no-clean solder paste is designed for printing, solderability and ICT testability in lead-free applications. It meets all current process challenges, including compatibility with 0201 devices and demanding pin-testability applications. EM909 can print downtimes up to 60 min. and features print speeds of 150 mm/s. Exhibiting continual printability, the solder paste suits small apertures such as 0201s and 16-mil-pitch devices. The paste is also solderable to several surface metallizations in air or nitrogen, and offers more than 12 hours of stencil life, more than eight hours of tack life and soft post-reflow residues for probeability characteristics. EM909 is available in Sn96.5Ag3.0Cu0.5 and other lead-free alloys. Kester, Des Plaines, Ill.
Programming System
The 2710 programming system combines 0.24 s/Mb programming technology, FX4 socket modules and a concurrent programming system, reportedly resulting in high throughput, reduced cost per device and fast turnarounds. Improved site hardware allows the capability to program devices with densities up to 4 Gbps. With two, four or six programming sites, the 2710 can program up to 24 devices simultaneously. Standard and automated socket modules make it suitable for low- to mid-volume production. The 2710 supports more than 22,000 devices with low-voltage devices down to 1.5 V (Vdd). BP Microsystems, Houston, Texas.
Assembly Robots
A range of compact 4-, 5- and 6-axis robots with repeatability down to ±0.015 mm are available for pick-and-place, dispensing, soldering, test handling and final assembly applications. The robots feature standard, easy-to-use programming software, controllers and teaching pendants. Standard and clean room models are available. Denso Robotics, Long Beach, Calif.
Thermal Process Kit
The SlimKIC 2000, a kit featuring an Auto-Focus oven-recipe search engine, a metal thermal sheild, higher-temperature thermocouples (TCs) and aluminum tape, lets manufacturers setup and manage lead-free thermal processes. The metal thermal shield offers protection in the compact physical dimension of the shield, benefiting inert atmospheres that require tighter tunnel heights. Auto-Focus recommends the appropriate oven recipe for any lead-free application before running a profile, enabling quick oven setup and optimized thermal processes. The kit includes the SlimKIC 2000 profiler with either 9 or 12 TC inputs, and operates in real-time or as a datalogger. The kit also features medium-temperature TCs rated to 400°C and aluminum tape for TC attachment. KIC, San Diego, Calif.