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Agilent, Speedline to Team on Lead-free Research Experiments
August 16, 2005 |Estimated reading time: Less than a minute
PALO ALTO, Calif. — Agilent Technologies and Speedline Technologies are collaborating in the lead-free process development and characterization of printed circuit board assemblies (PCBAs). With this, Speedline will use Agilent's lead-free-ready inspection systems in a series of experiments to document best practices associated with the transition to lead-free manufacturing. Such inspection solutions include the Medalist SP50 Series II Solder Paste Inspection (SPI) and the Medalist SJ50 Series II AOI systems.
Effective monitoring and process control in the solder steps are required to reduce defects, maintain desired yield and lower costs, according to both companies. Planned experiments include investigating and documenting the effect of various process aspects of the lead-free transition. With Agilent's AOI verification of paste and component placements, the results will establish critical, lead-free process recommendations to be leveraged across the industry for quick process optimization. Results will be presented as articles and professional papers to first appear at the Surface Mount Technology Association International (SMTAI) conference in September 2005.