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SMT, SMT China Announce Call for Papers for Upcoming Conference
December 31, 1969 |Estimated reading time: 2 minutes
SHANGHAI — SMT, SMT China and China Electronics Appliance Corporation (CEAC) announce the Call for Papers for the 2005 SMT China International Conference on Emerging Technologies & Lead-free Challenges. Held annually, SMT and SMT China Magazines will focus on SMT, emerging technologies and hot topics for modern assembly methods. The conference will be held on November 21-22, 2005, in conjunction with the CEAC's 66th China Electronic Fair (CEF) at the Shanghai International Convention Center.
Various new technologies will be examined, including: high-density interconnect and fine-pitch placement, equipment modular design, 3-D interconnect, lead-free reflow, EMS management, nanotechnology, optoelectronics, RFID, flip chip and MEMS. Modern SMT focuses on difficult steps of the latest assembly processes, which professionals must know for up-to-date practices.
The EU Directive, Restriction of Hazardous Substances (RoHS) in electrical and electronic equipment, requires all affected electrical equipment sold in Europe after July 1, 2006 to be lead-free, with similar legislation now being considered in other parts of the world such as China. The change to lead-free is affecting the global marketplace, motivating all suppliers and manufacturers to eliminate lead according to agreed transition plans. Producers of equipment not directly impacted by the legislation are also assessing the effects of changes in the supply chain and customer demand.
Papers from environmental managers and technical experts are sought on any relevant subjects, including:
High-density, fine-pitch placement Equipment modular design Process optimization programming 0201 and 01005 components SMT application in automobile and medical electronics Chip scale, BGA, flip chip and 3-D interconnection Nanotechnology and photoelectron RFID MEMS EMS management European, Chinese and other legislation on hazardous materials and recycling Company and research consortia projects and results Design issues (for ease of production and disassembly) PCB issues (effects of lead-free process temperatures, board finishes, etc.) Component issues (effects of lead-free process temperatures, BGAs, obsolescence, etc.) New finishes (plating technology, solderability and tin whiskering) Comparisons of solder alloys Alternative means of substitution (conductive adhesives, etc.) Lead-free manufacturing (examples of implementation, process considerations, inspection, etc.) Repair and rework (process control, mixed alloy systems, etc.) Reliability evaluations (research, product test and in-service, including new test methods) Lead-free and other product sectors (automotive, aerospace, etc.) Environmental considerations and studies (material availability, toxicity issues, etc.) Recycling (examples, plans and concerns) Business issues (supply chains, cost and benefit analysis, etc.)Presenters will be allotted 40-minute time slots for their presentation and discussion. Simultaneous Mandarin/English interpretation will be provided. Some papers may be grouped together in a forum or panel discussion. Please submit 300-word abstracts along with the registration form and a brief biography. The deadline for abstract submission is August 25, 2005, and the deadline for article submission is September 25, 2005 (note: please ignore the dates on the PDF form).
Presentation materials and papers must be non-commercial in nature, focusing on technology rather than a company's product. It is mandatory to electronically provide a print-quality paper or copies of the presentation slides for the Conference Proceedings. Speakers will receive discounted admission to the conference, including a copy of proceedings, any refreshments and the luncheon.
Companies interested in event sponsorship opportunities or exhibiting in the tabletop exhibition should e-mail Gail Flower, SMT editor-in-chief at gailf@pennwell.com, or Charlie Zeng, SMT China editor-in-chief at charliesmt@sina.com. For more registration information when available, please send contact details to Gail Flower.