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Continuously Configurable Cell Meshes SMT, Microelectronics Manufacturing
July 25, 2005 |Estimated reading time: 1 minute
ELGIN, Ill. — Panasonic Factory Solutions Company announced the availability of its Integrated Process Assembly Cell (IPAC), a continuously configurable, modular platform that mixes high-volume SMT manufacturing with advanced microelectronics in one machine. The IPAC features four continuously configurable modules for die attach/flip chip, dispenser, chipshooter and odd-form components. It also features a common operator interface, enabling ease of global use and is adaptable for future requirements. Because of its small footprint of less than one meter, it can fit easily into spaces, such as already constrained cleanroom floors. Because it is easily configurable, the IPAC can handle emerging back-end assembly markets such as SiP and 3-D assembly. The chipshooter feature was developed so back-end assemblers wouldn't have to repackage traditional SMT machines designed to handle large circuit boards with several feeder inputs. The dispensing configuration of the IPAC can handle a range of fluids required, such as underfill, dam and fill, flux spray, solder paste, thermal compounds, die attach adhesive and sealants using the appropriate pump, piston, auger or jet. Features of the die attach/flip chip configuration include capability for die placement accuracy down to 10 µm, dual-lane and dual-gantry design reaching up to 5,000 uph, 300-mm WDE, tape-and-reel and direct-die feeding supply options and precision mount-force control.
"Manufacturing is maturing," said John Macrina, group manager, microelectronics for Panasonic Factory Solutions. "The technology is not as challenging, but there's a focus on the cost of manufacturing. Manufacturers must meet the ramping requirements, which are getting even steeper; and life cycles are getting shorter." He continues, "The faster companies can react to changing requirements, the more competitive they can be. The IPAC gives domestic companies the edge they need to compete against off-shore manufacturing."