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IPC, JEDEC to Host Upcoming Lead-free Conference
July 25, 2005 |Estimated reading time: Less than a minute
BANNOCKBURN, Ill. — IPC – Association Connecting Electronics Industries and JEDEC – the Solid State Technology Association are slated to host the 9th International Conference on Lead-free Electronic Components and Assemblies August 17-19, 2005, in Singapore. The conference aims to address lead-free issues, such as complying with the European Union's Restriction of Hazardous Substances (RoHS) Directive, designing a RoHS compliance roadmap, tin-whisker issues, component readiness for "green" conversion and others.Educational course topics will include, but are not limited to, lead-free reliability and manufacturing, an overview of J-STD-001D, impacts of RoHS on electronics products, lead-free system compatibility, acceptability criteria of lead-free electronic assemblies based on IPC-A-610D, lead-free BGA and WLCSP and flip chip packaging. For additional information, please visit www.ipc.org/LFSingapore, or contact IPC's Registration department at (847) 597-2861.