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Dage Celebrates SEMICON West Success
July 15, 2005 |Estimated reading time: Less than a minute
FREMONT, Calif. — Dage Precision Industries, the industry leader in bond testing and digital x-ray technology, has successfully introduced the World's First High-Speed Bondtester, the Dage Series 4000HS at the SEMICON West 2005 show in San Francisco, California on July 12-14, 2005.
Paul Walter, Managing Director of Dage was extremely pleased with the turnout of attendees at the new West Hall of the Moscone Center in downtown San Francisco. "We were delighted with the positive response that the revolutionary new High-Speed Bondtester received," commented Walter. "Customers were inspired by our new high-speed bond testing technology that allows them to detect and screen out brittle fracture failures that may occur with lead-free solder alloys."
The addition of Zone Shear capability to the Dage Series 4000 Bondtester also received considerable attention from show visitors. "The ability to provide zone shear as well as cold-bump-pull test capability on the same system further expands the flexibility of the Series 4000 Bondtester," stated Walter.
Dage continued to show new technologies for its XiDAT XD7600 digital x-ray system for printed circuit board and package inspection at SEMICON West 2005. With industry leading 250 nm feature recognition capability, the XiDAT XD7600 continues to set the standard for x-ray inspection image resolution.