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ECD Now Shipping Thermal Profiler Software
July 5, 2005 |Estimated reading time: Less than a minute
MILWAUKIE, Ore. — ECD has introduced profiling for oven recipes with its Xpert 3 AutoM.O.L.E. software, which works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Xpert3 distills recipe development into three steps: 1. Create signature; 2. Plan target and 3. Set and verify. The Signature Wizard speeds through the process of creating an oven signature file for a reflow oven at a given convection rate. With oven selection in place, robust target profiles can be planned by choosing from 400 solder-paste formulations in the Xpert3 database. Entering assembly properties information completes the planning stage, and set and verify delivers the oven recipe. Benefits include solder-paste specification with settings of ramp-soak-spike or ramp-to-spike profiles, and the Transpose command immediately converts a profile to a new oven, all reportedly facilitating the lead-free transition.