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Teradyne's HPC Group Earns High PCB Manufacturing Scores
June 27, 2005 |Estimated reading time: Less than a minute
NASHUA, N.H. — Nashua, N.H.-based Teradyne, Inc.'s Connection Systems Division announces that its High Performance Circuits (HPC) group has demonstrated competitive benchmark scores for PCB manufacturing capability, quality and relative reliability.
Teradyne HPC recently submitted 30 test panels for test and analysis of the standardized IPC PCQR2 12-layer, 0.093"-thick, high technology design. These panels were fabricated in three different batches of 10 panels, each with one week separating the start of each batch. Each 18" x 24" test panel was manufactured identically using complex criteria on 24" x 28" process panels.
"The IPC PCQR2 database evaluations are like the Consumer Reports of circuit-board process capability," says Dinis Anselmo, front-end engineering manager for Teradyne Connection Systems. "These tests and comparative analyses confirm that we make reliable technology with high levels of quality PCB manufacturing."
"The IPC PCQR2 test and analysis data provides database subscribers with statistically based data to compare PCB-fabricator-demonstrated capabilities and make informed supplier-selection decisions," says David Wolf, vice president of technical marketing for Conductor Analysis Technologies, Inc. (CAT, Inc.), provider of technology and program management for the IPC PCQR2 database.
For more information on the IPC PCQR2 database, please visit www.pcbquality.com.