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NEDA Industry Summit Draws Attendee Interest
June 15, 2005 |Estimated reading time: 1 minute
ATLANTA — On June 9th, representatives from more than 80 companies met in Chicago for the NEDA Industry Summit: Negotiating the Economic, Legal and Logistic Challenges of RoHS and Lead Free Compliance, following up to the one held in January 2005 to keep the industry informed of important issues.
In the summit format, industry experts and attendees discussed various non-technical issues surrounding the pending regulations, encouraging table discussion and sharing of possible solutions. Topics brought to the table included: the legal ramifications of compliance; product labeling, information and reporting needs; worldwide implementation; and a supply chain segment-by-segment update. Information on the pending IPC Materials Declarations Form standard IPC 1752 was also of particular interest, which is available for review and comment for 60 days at www.ipc.org. Various speakers urged attendees to take advantage of this window of opportunity.
Summit presenters included:
Laura Blaisdell, All American Leonie Tipton, Arrow Electronics, Inc. Jean-Phillipe Brisson, Allen & Overy Ken Stanvick, Design Chain Associates Jay Smith, Future Electronics Melanie Pizzey, TTI, Inc. Mary Carter Berrios, KEMET Electronics Corp. Michael Griffith, KOA Speer Electronics Joe Bernstein, Subtronics Assembly, Inc.Speaker presentations are available for review at www.nedassoc.org. NEDA will host a third summit before the end of the year to continue the discussion on this important topic.