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Dr. Jennie Hwang to Lead Six-part Lead-free Series
June 6, 2005 |Estimated reading time: 1 minute
SAN JOSE, Calif. — Covering the assembly line from preparation to production to reliability, Dr. Jennie Hwang will present a series of lead-free courses from June 27 through June 29, 2005, in San Jose, Calif. In the session, Lead-free Preparation for Implementation (Parts 1 and 2 combined), attendees will receive information regarding specific critical factors for preparing lead-free implementation. Based on Dr. Hwang's "Environmentally Friendly Electronics Lead-free Technology," the course covers topics such as global legislative status, technological base, product assessment and manufacturing considerations. Viable lead-free alloys will be ranked in their key performance parameters in relation to production process, potential defects and reliability. Part 2 will cover properties and performance of PCB surface finishes and component coating/terminations. Lead-free Implementation and Production (Part 3) is based on the book "Lead-free Implementation: A Manufacturing Guide." The course will present process parameters and successful high-volume production results from OEMs and EMS providers. Common lead-free defects and preventative steps also will be discussed. Lead-free Reliability and Manufacturing (Part 4) combines manufacturing knowledge with resulting solder-joint reliability data to provide a level of understanding of lead-free solder interconnection reliability in material basics, production process and actual performance, as well the relationship between each factor. Lead-free System Compatibility — Materials and Process (Part 5) will focus system compatibility, the workings among components, BGA/CSP solder spheres, assembly solder paste and PCB surface finishes. The estimation and effects of solder-joint composition changes with different component coatings also will be covered. Lead-free and the Role of Bi — All You Should Know about Bi (Part 6) will discuss the use of bismuth (Bi) in the lead-free transition. This session addresses the aspects of the role and effects of Bi, as well as issues and perceptions. Results and data regarding the use of Bi in or with lead-free solder joints, including Bi from component leads and PCB surface finishes, as well as the performance of Bi-containing solder joints will be covered. Each course is a half-day session. A discount is offered when signing up for two or more courses. For more information, please e-mail pgoel@blackfox.com, or call (303) 684-0135. To register for this series, please click here.