-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
OSP Process Ideal for Mixed-metals
May 31, 2005 |Estimated reading time: Less than a minute
WEST HAVEN, Conn. — The ENTEK PLUS HT organic solderability preservative (OSP) process from Enthone, Inc., a business of Cookson Electronics, maintains solderability through nine lead-free reflows, delivering high-reliability BGA solder-joint strengths. It maintains eutectic process capability for mixed metal processing, such as electroless nickel immersion gold (ENIG). The OSP selectively deposits on copper while leaving gold connectors or metallic heat sinks free of contaminants. As part of a four-step process, a cleaner removes trace contaminates and adequately wets small pad features; the Microetch ME-1020 enhances the surface topography and rinses the etched copper. Next, a precoat prepares the surface for a reliable coating, and then the OSP operates at a low pH, ensuring a stable final finish.