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Indium's Dr. Lee to Present at ECTC and IPC Soldertec
May 25, 2005 |Estimated reading time: Less than a minute
UTICA, N.Y. — Indium Corp. of America's Dr. Ning-Cheng Lee, vice president of technology, will present at two upcoming conferences — the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Fla., to be held May 31, 2005, and IPC Soldertec in Barcelona, Spain, to be held June 7-10, 2005.
Dr. Lee will present Lead-free Soldering — Metallurgical Fundamentals, Failure Modes and Process Optimization at both ECTC and IPC Soldertec, focusing on:
Lead-free solders and surface-finish materials; Factors affecting solder performance and solder-joint reliability; and Approaches for improving lead-free performance.Also at IPC Soldertec, Dr. Lee will present a short paper, titled, "A Kinetic Approach to Profiling for Voiding Control in Lead-free Reflow Soldering". Dr. Lee has extensive experience in developing high-temperature polymers, encapsulates for microelectronics, underfills and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost-of-ownership.