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Summit Unveils New 100% Tin Reflow Process
May 13, 2005 |Estimated reading time: Less than a minute
THOMASTON, Conn. — Summit Corp. of America is providing lead-free plating of strip and wire for connectors, lead frames, and electronic devices for the telecommunications, appliance, automotive, computer, semiconductor, and electronics industries, employing its Reflow Metallization process developed in-house. The company can also plate any metal or combination of metals in continuous strips, while meeting the lead-free legislation international standards.
Summit's process plates pure tin over copper or brass substrates, extending components' shelf lives and solderability, and eliminating tin whiskering, which can be potentially detrimental. The process also eliminates the need for organic brighteners or leveling agents that are harmful to the environment, and are both costly. The end result is a durable, low-stress, fully bright tin coating, meeting thermal cycling challenges and other environmental factors.