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2004 SMT Vision Products
December 31, 1969 |Estimated reading time: 7 minutes
ADHESIVES/COATINGS/ENCAPSULANTSConductive Film Adhesive
Anisotropic Conductive Film (ACF) Adhesive 7313 reportedly allows faster assembly time, reduces assembly costs and saves space in tight enclosures. The ACF 7313 can connect flex circuits to PCBs, flat-flex circuits and other flex circuits. Electrically conductive, the adhesive consists of a heat-bondable, thermoplastic adhesive matrix with conductive particles, allowing for circuit-line interconnection through the Z-axis. The particles also are spaced far apart for electrical insulation within the adhesive plane. The adhesive bonds at low temperatures, is highly resistant to solvents and is suitable for applications with a pitch down to 500 µm. Minimum conductor spacing is 0.25 mm, and minimum pad overlap is 0.75 mm2. 3M Electronics Markets Materials Division, St. Paul, Minn.
ASSEMBLY TOOLSAutomated Programmer
A compact, automated programming platform designed for medium- to high-volume environments is available for a mix of programmable devices. The PS288FC-HiE is a high-density, automated programming solution with throughput capabilities up to 1350 cph. The system also features the FlashCORE programmer architecture, which programs theoretical minimum programming times of silicon. The programmer is said to reduce installation complexity, setup time and costs, while its easy-to-use interface may cut operator fatigue and reduce changeover time. Data I/O Corporation, Redmond, Wash.
CLEANING & ENVIRONMENTALLY FRIENDLY PRODUCT/SERVICESPaste Removal System
Sonic One is a fully automatic, ultrasonic paste/adhesive removal system that provides wash, rinse and dry functions for advanced SMT stencil cleaning/misprints systems. Designed to remove all paste types, including rosin (R, RMA, RA), water-soluble (OA) and no-clean pastes, as well as SMT adhesives, the system can take a misprinted board and ultrasonically clean the misprinted side with no damage to the populated side. Due to its internal wash-solution recycler, the system offers low operating costs. Wash solution is filtered automatically and reused for full chemical life and low chemical costs. The system also features a loading system, wash-solution heater, rinse-solution filtration system and built-in air knifes for fast drying without heat. Aqueous Technologies Corporation, Rancho Cucamonga, Calif.
COMPONENTSThin Array Plastic Package
A thin array plastic package, or TAPP, features high input/output capabilities, single and multiple rows, 0.4-mm thickness for some applications and an exposed die attach pad for thermal performance. When soldered to the PCB, the exposed die pad provides a direct thermal path from the chip down to the copper plane on the PCB, which acts as a heatsink. This is said to cut thermal package resistance in half. Package designs offer suitable power/ground ring options for high electrical performance. The package is available in lead-free and environmentally friendly options. Because of its process flow and chemically milled processing, the package also offers high yields. ASAT, Inc., Pleasanton, Calif.
CONTRACT SERVICESOutsourced Cleaning Process
The Outsourced Cleaning Process is a contract cleaning service involving all phases of cleaning - from parts washing to water defluxing. With operating facilities in Manchester, N.H., and Nashville, Tenn., the service is capable of either aqueous, semi-aqueous and vapor phase cleaning technologies. The facilities also offer experienced staff to help customers decide which cleaning process best suits their needs. The service is said to eliminate customer worry regarding hazardous waste issues or EPA compliance, as well as operating costs, cleaning maintenance costs and labor or equipment costs. Kyzen Corp., Nashville, Tenn.
DISPENSING EQUIPMENTDigital Deposition System
CHAMPION 6809 is a servo-driven, automatic system that can be configured to match application requirements - from dots to underfill. A single, true-volume pump can fire up to 90,000 dph below 0.5 nl to form high-definition dots, lines, fills and builds, shaped by true-piston positive displacement. A graphical user interface (GUI) allows intuitive programming and control with a high-contrast color LCD display. Accuracy is measured to 1.76% at three sigma. A closed-circuit camera with picture-in-picture display eases programming and inspection, while an Automatic Vision Correction System establishes X, Y and Ø part orientation, and compensates for stretch, skew and misalignment. A contact probe and a non-contact laser also are available for height sensing and mapping. Creative Automation Co., Sun Valley, Calif.
INSPECTIONDigital X-ray System
The XiDAT XD7600 digital X-ray system for PCB assembly acquires image resolutions of 1300 x 1000 over 65,000 gray-scale levels. It also enables oblique angle views up to 70º for any position, and 360º around any point of the 458 x 407-mm inspection area. The system allows inspection of interconnections on BGAs, CSPs and other area-array devices. It features filament- and maintenance-free X-ray tube technology and enables recognition to 250 nm. An operating system that can be configured to spot defects, and includes lamniography data analysis tools, controls inspection analysis. Dage Precision Industries, Inc., Fremont, Calif.
PICK-AND-PLACEReel-to-Reel RFID Assembly System
The reel-to-reel RFID assembly system enables either passive or active designs, direct die pick from wafers down to 0.008” and positive-displacement dispense technology. With throughput up to 9,000 cph, 20”-wide Web process capability and 12-µm placement repeatability at ±3 sigma, the system enables ancillary placement for components such as batteries, as well as tape-and-reel die placement. The application uses a dispenser module with a patented positive displacement pump technology and complete closed-loop process control on the thermal compression station. The cure station provides pressure control of each thermode, while real-time feedback provides statistical process control. The system is modular and fully automatic, enabling single-user operation. Tyco Electronics Automation Group, Willow Grove, Pa.
PRINTINGPrinting Machine
The VectorGuard printing system delivers frameless foil advantages and requires no dedicated loading base. Its aluminum extrusions, which are fixed to the four edges of the laser-cut foil and joined by plastic corner pieces, boost rigidity and cover foil edges completely - easing assembly and changeover. This also allows for safe handling without the need for gloves. Due to increased rigidity, the foils can be cleaned without a washing jig and fully disassemble for recycling. Large 29” × 29” stencils, PumpPrint and electroformed stencils also are available. DEK International, Flemington, N.J.
REWORK & REPAIRRework Process
The StencilQuik process is said to ease rework while increasing the yield of reworked BGAs. The system reduces the repair of a solder mask to a few minutes as it positions and repairs the area. StencilQuik also is said to eliminate solder-joint shorting and boost electrical reliability of interconnects. By combining polyimide materials with hole patterns of traditional screen printing, the system allows for reliable area-array device placement. Electrical reliability of interconnects for the area array device is increased when compared to standard “tax flux” reworked parts. BEST, Inc., Rolling Meadows, Ill.
Automated High-volume Rework
The Fineplacer Micro HVR system is designed to address the high-volume rework market where hundreds of boards must be repaired due to high value, component scarcity, or in situations where manual rework is illogical. This tool allows hands-free, automated sequencing of repair steps: component de-solder and discard, residual solder removal and component re-solder. All steps are performed without operator intervention, resulting in a high-yield process. With 10-µm placement accuracy, the HVR is suitable for applications from large BGAs to fine-pitch, small-bump CSPs and flip chips. This lead-free capable system can be configured with solder-paste dispense for 0201 devices, where exact placement and precisely directed airflow prevent component disturbance in densely populated areas. With higher melting point lead-free solders, the HVR can perform for extended periods of time at elevated temperatures (typically 30° to 50°C above Sn/Pb eutectic reflow temperatures). Finetech Inc., Phoenix, Ariz.
SOFTWARERemote Diagnostic Software
RemoteTech, a diagnostic software, reduces field service visits, mean-time to repairs and lowers maintenance costs. The software enables direct access to compatible products, allowing users to view operating equipment conditions in real time from a remote support center. Technicians can view relevant recipe files and error logs, enabling advanced troubleshooting and problem solving over the telephone and Internet. If a customer prefers, software upgrades can be uploaded to the machine. Speedline Technologies, Franklin, Mass.
SOLDERING EQUIPMENTConvection System
The eXelsius X-600 Phase Convection soldering system solders surface mount assemblies, cures flip-chip underfill and glob-top encapsulation and is said to reduce operating costs and downtime. Boards are loaded into one of four phase convection levels using a hermetically sealed loading system. Each level is made of three phase units, each with their own conveyor where boards are heated while remaining static. A pyrometer that measures exact board temperature regulates temperature in the re-circulating convection systems of each phase unit. The X-600 measures 8.5’ long, and requires no external exhaust, reducing effects on room temperature and meeting ISO 9002 requirements. VI Technology, Haverhill, Mass.
SOLDERING MATERIALSLead-free Solder Paste
Using activators that force a solder joint to remain smooth and shiny, even after high-temperature reflow, the EnviroMark 907 lead-free solder paste produces shiny solder joints. The paste is said to ease the conversion to lead-free and reduce or eliminate the need to upgrade inspection materials or retrain inspectors. Reflowed in air or nitrogen, the paste allows up to 150 mm/s print speeds. It also exhibits suitable cold and hot slump behavior, preventing bridges and solder-ball formation. Kester, Inc. Des Plaines, Ill.
TESTINGLead-free Process Validation Program
The CE Analytics Lead-free Process Validation Program allows assemblers to congruently validate lead-free process capabilities. The two-part program contains a test kit featuring laminates, pad finishes, stencils, lead-free solder paste and solder wire, as well as boards and lead-free components. It also offers analytical evaluation and process capability validation performed in the laboratory using boards processed on the customer’s own equipment, evaluating them to IPC and J-STD requirements. The program provides a full validation report and a certificate for all processes that meet lead-free standards. Cookson Electronics Assembly Materials, Providence, R.I.