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Cookson, Speedline Partner on Lead-free 'Checklist'
April 29, 2005 |Estimated reading time: Less than a minute
JERSEY CITY, N.J. — Cookson Electronics Assembly Materials Group and Speedline Technologies are collaborating on the development of a comprehensive "Lead-free Implementation Checklist" to assist electronic assemblers in gearing up for the lead-free transition. The list provides important details that should be confirmed for assembly equipment, materials, shop-floor segregation, training of personnel, process validation, process refinement and yield enhancement.
"Joe Belmonte, the product manager for Speedline's Advanced Technology Group, and I put together over 30 years of process engineering and R&D experience at our respective companies to develop this 'Lead-free Implementation Checklist'," says Chrys Shea, manager of R&D applications engineering at Cookson Electronics. "Our informal discussion on the subject very quickly evolved into a formal process of collecting and cataloging all of the information required to run lead-free processes. Our overriding goal was to help our customers plan and execute the lead-free transition by not only providing a methodical framework to follow, but also alerting them to some of the potential pitfalls they may not have previously envisioned."
The "Lead-free Implementation Checklist" is available by clicking here, or by visiting Speedline's website at www.speedlinetech.com/lead_free/index.aspx.