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SMTA Opens Call for Papers for 2006 Pan Pacific Symposium
April 27, 2005 |Estimated reading time: 1 minute
MINNEAPOLIS — The SMTA-sponsored 2006 Pan Pacific Microelectronics Symposium, to be held January 17-19, 2006, in Hawaii, is announcing that the Call for Papers is now open. This annual event focuses on critical business markets and technologies of microelectronics packaging, interconnection, microsystems, nanotechnology and assembly.
The Program Committee is seeking participants to present recent research results on any of the following topics:
Business: cross-cultural management, economics and cost analysis, green manufacturing (energy conservation, lead- and halogen-free, etc.), manufacturing management, outsourcing strategies and roadmaps. Packaging: 3-D and stacked packages, ball grid arrays (BGAs), chip scale, display drivers, embedded devices, flip chip, integrated passive devices (IPDs), MCM/SiP, RF and microwave, thermal management and wafer-level assembly. Interconnection: advanced PWBs, co-fired ceramics, flat panel displays (FPDs), flex/flex rigid, high-density interconnects, microvias, shaped circuits and thin and thick film materials. Markets: characterizations, penetration strategies, segmentation, technology drivers, trends and forecasts. Assembly: automation control, component placement, direct chip attach, materials and processes, repair and rework and test and troubleshooting. Microsystems and Nanotechnology: actuators, DFX, MEMS/MOEMS, nanomaterials, nanosystems, optoelectronics, partitioning strategies and sensors.Abstracts of 500 words should be submitted by July 15, 2005, with title and author contact information. Please visit the Call for Papers page on the SMTA's Website at www.smta.org/pan_pac/index.cfm, or submit abstracts to SMTA administrator JoAnn Stromberg at joann@smta.org. Abstracts should describe results from experiments and new techniques that focus on technical or economic data.