-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Online Guide Helps with Achieving EMC with Thermal Design
April 27, 2005 |Estimated reading time: 1 minute
MARLBOROUGH, Mass. — A new step-by-step guide from Flomerics integrates thermal and EMC design to help designers identify and resolve system-level electromagnetic compatibility (EMC) issues, and may be found at www.floemc.com/stepbystep. Most new electronic products reportedly fail first-time EMC testing because manufacturers do not typically evaluate system-level EMC performance prior to prototyping.
The first step in the process follows thermal budget development, which is common practice in most teams involved in electronic design. The new approach uses analogous methods to simultaneously develop a full-spectrum shielding requirement, which is created by accruing EMC requirements that are set by regulatory bodies, the customer and internal and external emissions susceptibility considerations. The thermal model initiates an EMC simulation of the enclosure to identify resonances and determine which areas are sensitive from a shielding effectiveness standpoint.
The next stage of thermal management usually involves refining the simulation model. "Compact" models used in the simulation up to now may be replaced by more detailed and accurate models. The same refinements that are added to the thermal model make it possible to start looking at the effect of the physical layout on radiated emissions. A more detailed system-level model helps engineers quickly zero in on problem areas, such as a heat sink that acts as an antenna, and how the box structure contributes to emissions.
As the design process continues, mechanical engineers perform detailed thermal analysis of components that have been identified as potential problems. At this stage, engineers make adjustments to optimize the design from a thermal standpoint and, at the same time, determine the effect of design changes on EMC. For example, the effects of grounding heat sinks may be investigated, and PCB shields may be introduced to reduce radiation from high-speed components.
Combining thermal and system-level EMC design within an integrated analysis environment can streamline design collaboration between mechanical and EMC engineers, enabling early identification and remedy of system-level EMC compliance issues, and drastically reducing the risk of late-cycle compliance failure.