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Lead-free Products Focus at NEPCON
April 13, 2005 |Estimated reading time: Less than a minute
WEST CONSHOHOCKEN, Pa. — The Circuit Materials Division (CMD) of Heraeus will introduce its F10B Series of no-clean solder pastes at NEPCON East in Boston, Mass., May 4-5, 2005. The F10B Series offers print-to-print consistency with high wetting capabilities. It complements the company's line of tack fluxes aimed at rework and solder ball attachment for no-clean and water-soluble applications.