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Pick-and-Place Machine Boosts Throughput
April 8, 2005 |Estimated reading time: Less than a minute
STOCKHOLM, Sweden — The HYDRA Speedmount 21k ER, which handles component sizes from 0201 up to 15x15 mm large ICs, is now available from MYDATA automation AB. A Linescan vision system enables on-the-fly vision centering. The mounthead is compatible with a wide range of tools, as well as the automatic tool exchanger (ATE). The new H05 tool for the biggest components, and the H06 tool for ultra-small chips are two new tools specifically developed for the HYDRA Speedmount 21k ER. TPSys software optimizes operation, including pick-up sequences and tool changes.