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IPC Revises IPC-A-610D and J-STD-001D Standards
December 31, 1969 |Estimated reading time: 2 minutes
ANAHEIM, Calif. - Updating industry assembly standards often is a long process. It particularly is difficult to incorporate new and emerging technology into standards that have a strong reliance on established Best Manufacturing Practices. With minimal lead-free support data available, industry committees have met the challenges of updating or establishing workable criteria.
J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, requires process-control methodology and provides acceptability requirements for soldered connections. In contrast, IPC-A-610, Acceptability of Electronic Assemblies, provides standardized, visual-acceptability requirements for electrical and electronics assemblies.
J-STD-001 “includes materials, methods and acceptance criteria” while IPC-A-610 includes “visual standards…that reflect the requirements of existing IPC and other applicable specifications.” Where acceptance requirements for soldered connections are available in J-STD-001 and IPC-A-610, the requirements are the same.
It is incorrect, however, to believe that Revisions D of both standards only involved lead-free. During the development process, every criterion was reviewed and updated as needed.
The background for developing IPC-A-610 and J-STD-001 standards is interesting. Standards were released as Revision C in 2000. However, within a year, the IPC-A-610 committee developed an amendment to clarify or fill in gaps in the criteria, where acceptable conditions were described, but no defect threshold was stated.
Official committee meetings for creating Revision D commenced at IPC’s APEX in the spring of 2001. Over the next four years, industry experts participated in some, or all, of the 48 committee meetings, as well as other working group meetings and teleconferences. At the end of the process, the standards were balloted in late 2004. Each document received substantive comments, as well as some “No” votes. Committees resolved these comments; and a second ballot was circulated. In the second ballot, all original negative ballots cleared, however, a few new negative comments were received. All issues except for one related to BGA void-defect thresholds were resolved; and IPC went forward with publication.
Tables 1 and 2 show ballot results for both documents.
In Revision D, several additions, clarifications and some reformatting occurred. Fortunately, few changes were made from Revision C criteria, which made the transition smoother for both documents. Format changes include:
- In both documents, common elements of connection criteria, such as lead forming, placement and solder criteria are grouped together so users don’t have to search through several chapters.
- A chapter specific to thru-hole, with subsections for supported and unsupported holes, has been added. Criteria are provided for intrusive soldering (pin-in-paste) in both documents.
- The solder chapter combines solder anomalies previously found in multiple chapters of IPC-A-610D.
- A new chapter combining component damage criteria was developed.
- Requirements common to the entire assembly, such as conformal coating, marking, cleaning and conductor/land damage are in a single chapter of IPC-A-610D.
- The defect summary table has been moved to an appendix in J-STD-001D. Moving this clarifies that users can reference only the requirements in each clause, not an abbreviated summary table.
Content changes and additions to the standards include the addition or modification of pictures and illustrations; lead-free information; enhanced BGA criteria; support for plastic “no-lead” packages; clarification on solder-ball and solder-webbing criteria and clarification of criteria for connecting wires/leads to terminals.
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Both revisions are available for purchase from IPC and distributors. IPC-A-610D is $50 for IPC members, $100 for nonmembers, while IPC J-STD-001D is $40 for members, $80 for nonmembers. Further information can be found at www.ipc.org/onlinestore.com.
- Jack Crawford, IPC director of certification and assembly technology