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News
December 31, 1969 |Estimated reading time: 6 minutes
Celestica Helps Ease Strain of RoHS Compliance
TORONTO, Ontario - The transition to lead-free was one of the major concerns noted at the recent IPC Printed Circuits Expo, APEX and Designers Summit in Anaheim, Calif. Discussions on Declarations of Materials, lead-free labeling, warehousing and policing were just a few topics of concern. While companies pull resources in the dash to meet the European Union’s July 1, 2006, deadline, it seems that the electronics industry will need to continue pulling together to help reach compliance. Celestica, Inc.’s Green Services Solution has been established to help companies meet compliance regulations of the Restriction on Hazardous Substances (RoHS) legislation. The Green Services Solution gives OEMs strategies, such as customized end-to-end services or on-demand solutions, to reach lead-free compliance quickly and cost effectively. Celestica’s Green Services are flexible and offer OEMs several product conversion options, including:
Environmental Compliance Acceleration Program. This consulting service aims to speed the establishment of OEM compliance programs, develop customized compliance roadmaps, offer embedded knowledge of the move to lead-free and distribute R&D data.
Full Turnkey Product Conversion Services. Celestica will manage full product conversion to RoHS-compliant products through several integrated supply chain and engineering services. Celestica eases transition management requirements and costs, allowing OEM design teams to focus on core competencies, such as new product designs.
Technology Qualification Services. Using Celestica’s IP and laboratory equipment gives OEMs the ability to ensure that new products meet quality, reliability and compliance requirements without additional costs or equipment investments.
To date, Celestica’s scientists and engineers have developed compliant assembly processes; resolved technology and reliability issues related to the restriction of several materials, including lead, in solder and reflow processes; and lead consortia groups working toward globally consistent standards. Upcoming initiatives include co-hosting an International Wireless Packaging Consortia (IWPC) event in Toronto from August 10-13, 2005. For further information on Celestica’s Green Services Solutions, visit www.celestica.com.
PCB Book-to-bill ratioBook-to-Bill Ratio Continues to Rise
NORTHBROOK, Ill. - The IPC IMS/PCB book-to-bill ratio for January 2005 rose from 1.04 to 1.08. IPC reports separate statistics for the rigid PCBs and flexible circuit segments, with a book-to-bill of 1.00 for rigid PCBs and 1.36 for flexible circuits. For these two segments combined, sales billed (shipments) in 2005 increased 9.2% year-over-year, and orders booked increased 20.2% from January 2004.
January’s overall book-to-bill level continued to rise, and orders booked for January 2005 increased 9.2% from January 2004.
Universal Instruments Opens Suzhou Facility
SUZHOU, China - Universal Instruments has opened its Suzhou Technology Excellence Center (TEC) in Suzhou, China, expanding its R&D efforts. The facility features a technology gallery, research laboratory and display/demonstration product room. The TEC also enhances the company’s process support in the areas of technology, research and training, prototyping, yield improvement and failure analysis. The China market accounts for nearly half of Universal’s business and more than half of its platform products will be manufactured in Sekhou, Southern China, later this year.
Military Electronics Production To Lose Pace
LOS ALTOS, Calif. - Global defense budgets made up nearly $900 billion of outlays last year, claims a recent Henderson Forecast from Henderson Ventures. Military markets, however, generally are closed to outsiders. Despite this, more than half of the world total came out of U.S. pockets in 2004. Total U.S. military outlays reached $457 billion, including “Supplemental” spending for Homeland Security and the wars in Iraq and Afghanistan. Total outlays will surge by 6 to 7% during 2005 and 2006, claims Henderson Ventures. Supplementary appropriations largely are distributed to military pay, ammunition and operations and maintenance. Military electronics opportunities are concentrated in research, development, test and evaluation and procurement portions of the budget. These areas, it seems, will experience downward pressure from supplemental spending. As a result, outlays for these areas are expected to slow through 2006. Fiscal-year 2006 budget recommendations, which were submitted to Congress, will be modified by political considerations and different perceptions of national security priorities, claims Henderson Ventures. Because of this, if the Iraq pacification program is completed, or nearly completed, in 2006, output is expected to drop 5.5% by 2007; creating leaner times for the military electronics production sector.
Sony Restructures Management Teams
TOKYO, Japan - The management team of Sony Corporation has proposed a restructuring plan designed to expand upon its core strengths as a global electronics, entertainment and technology company. Effective June 22, and subject to approval at Sony Corporation’s Ordinary General Shareholder’s Meeting that day, the following management team changes will occur:
- Sir Howard Stringer, current chairman and CEO of Sony Corporation of America, will assume the position of chairman, group CEO and representative corporate executive officer, Sony Corporation. Howard will run Sony’s overall group business operations from New York and Tokyo and continue his role as head of the Entertainment Business Group and Sony Corporation of America.
- Dr. Ryoji Chubachi, currently corporate executive officer; executive deputy president and COO of MSNC and EMCS will become representative corporate executive officer, president of Sony Corporation and CEO of the Electronics Business Group. Chubachi will oversee responsibility for corporate strategy and resource allocation.
- Mr. Kastumi Ihara, current corporate executive officer; executive deputy president and group CFO will take over as representative corporate executive officer; executive deputy officer and group CFO, Sony Corporation.
Sony believes this new structure will allow the company to streamline operations and focus more on operating globally in a proactive and strategic manner.
Sony Manufacturing Systems America, Inc. (SMSA), located in Lake Forest, Calif., also will strengthen its sales and marketing initiatives in the North American market. SMSA recently introduced a next-generation cellular surface mounter system for high-speed and high-accuracy electronic chip mounting. The Sony surface mounters will become available in Spring 2005 throughout North America.
Microsoft Will Host TFI June Forum
ALAMEDA, Calif. - Sponsored by WebPlan and hosted by Microsoft, Technology Forecasters Inc.’s (TFI) June Quarterly Forum events are scheduled to take place in Seattle, Wash., June 9-10, 2005. Microsoft joined the Quarterly Forum for Electronics Manufacturing Outsourcing and Supply Chain to firm its relationships with outsourcing and supply-chain partners within the industry. “Microsoft is pleased to host this event to help our suppliers and supply chain partners learn about, and put into practice new business efficiencies to our mutual benefit,” states Tom Schafenacker, Microsoft group program manager, hardware manufacturing and procurement. TFI believes that attendees will be especially interested in the June Quarterly Forum because of Microsoft’s involvement, as well as the release of TFI’s annual benchmarking study on the EMS industry.
E-waste Market to Hit $11B by 2009
NORWALK, Conn. - It is anticipated that the worldwide market for electronic waste (e-waste) will rise at an average annual growth rate (AAGR) of 8.8% from $7.2 billion in 2004 to $11 billion in 2009, shows the RE-128 Electronic Waste Recovery Business report from Business Communications Company. Growth in metals mined from end-of-life electronics waste will outpace broader recycled materials markets, growing at 8.1% AAGR, shows the study. The overall market for post-consumer recycled materials from electronics also is expected to remain strong over the next five years. The main impetus of this being current and future regulations on OEMs to manage hazardous waste materials from production to end-market.
The amount of e-waste has been growing rapidly with the rise of the information society, states the Business Communications Company; and equals 1% of solid waste on average in developed countries. This number is expected to grow to 2% by 2010. With China in the lead, developing countries stand to produce the fastest segment of the e-waste market, potentially tripling output over the next five years. Electric and electronics equipment equals 6% of the U.S. gross domestic product, up from 5% a decade ago. China’s growth, however, shadows the U.S. with a gross domestic product growing in excess of 8% per year vs. 3% in the U.S. The obsolescence rate of electronics equipment also is on the rise. Global computer sales continued at over 10% annually and DVD sales are doubling each year. On the contrary, product life cycles are shrinking from 10 years for a TV to two to three years for a PC.