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Indium to Exhibit at SMT/Hybrid/Packaging
March 30, 2005 |Estimated reading time: Less than a minute
CLINTON, N.Y. — Indium Corp. of America is slated to exhibit at SMT/Hybrid/Packaging 2005 conference in Nuremberg, Germany on April 19-20, 2005. Their exhibit will feature advanced technology lead-free electronics assembly materials, spanning solder pastes, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.Along with their distributor, GPS Technologies, Indium will be exhibiting in Hall 7, booth #323. Experts will be available to answer questions on lead-free electronic assembly materials and processes. Technical papers, articles and other information will also be available.