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New Solder Flux Provides Maximum Process Window
March 2, 2005 |Estimated reading time: Less than a minute
CITY of INDUSTRY, Calif. — Multicore MF210 from Henkel Technologies is designed specifically for surfaces with poor solderability, and is compatible with all solder alloys. This no-clean, halide-free sustained activity flux has been formulated to work over a wide range of solder resists, and is compatible with rosin- and OSP-based surface preservatives.
Multicore MF210 offers a maximum process window without resin for applications requiring high performance and reliability. The material allows for high-speed soldering on conventional leaded and surface mount components, through-hole penetration, and is designed for optimum surface wetting. Formulated for use in foam, spray or wave fluxes, it is similar to ordinary fluxes on standard wave-soldering machines.